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NT2H1311F0DTLH
NXP Semiconductors
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$0.7084 | Yes | Active | YES | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | NO | ASYNC, BIT | 1 | 5.25 V | 4.75 V | OTHER | Not Qualified | e4 | 1 | 70 °C | -25 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VFBGA | SOLCC4,.08,20 | Nickel/Palladium/Gold (Ni/Pd/Au) | NXP SEMICONDUCTORS | SON | 4 | SOT1312-1 | compliant | NXP | ||||||||||||||||||||||||||||
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MCP2515T-E/SO
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | CAN, SPI | 0.125 MBps | 40 MHz | YES | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | SYNC; BIT ;BYTE | NRZ | YES | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G18 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.65 mm | 7.5 mm | 11.55 mm | MICROCHIP TECHNOLOGY INC | SOIC | 18 | compliant | Microchip | 7.50 MM, LEAD FREE, PLASTIC, SOIC-18 | EAR99 | 8542.39.00.01 | |||||||||||
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MCP2515-E/P
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | 14 | SPI | 0.125 MBps | 40 MHz | NO | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, CAN | CMOS | NO | SYNC; BIT ;BYTE | NRZ | YES | 1 | 8 | 10 mA | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDIP-T18 | e3 | 125 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 7.62 mm | 22.86 mm | MICROCHIP TECHNOLOGY INC | DIP | 18 | compliant | Microchip | 0.300 INCH, LEAD FREE, PLASTIC, DIP-18 | EAR99 | 8542.39.00.01 | |||||||||||
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USB3280-AEZG
Microchip Technology Inc
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$1.1386 | Yes | Active | USB | 8 | 60 MBps | 24 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | 24 MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE | NO | ASYNC, BIT; SYNC, BYTE | NRZI | YES | 2 | 3.6 V | 3 V | INDUSTRIAL | S-PQCC-N36 | e3 | 3 | 85 °C | -40 °C | 260 | TS 16949 | 36 | PLASTIC/EPOXY | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | QFN-36 | EAR99 | 8542.31.00.01 | ||||||||||||
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LAN8700C-AEZG
Microchip Technology Inc
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$1.2282 | Yes | Active | 12.5 MBps | 25 MHz | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | ASYNC, BIT; SYNC, BYTE | NRZI; BIPH-LEVEL(MANCHESTER) | YES | 4 | 41.3 mA | 3.6 V | 3 V | COMMERCIAL | S-PQCC-N36 | Not Qualified | e3 | 70 °C | TS 16949 | 36 | PLASTIC/EPOXY | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | QFN | 36 | compliant | Microchip | 6 X 6 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-36 | EAR99 | 8542.39.00.01 | ||||||||||||||
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SC16C550BIB48,151
NXP Semiconductors
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$1.5665 | Yes | Obsolete | 8 | 3 | 0.375 MBps | 48 MHz | YES | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | ALSO OPERATES AT 2.5V SUPPLY | NO | ASYNC, BIT | NRZ | NO | 1 | 5.5 V | 4.5 V | INDUSTRIAL | S-PQFP-G48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Tin (Sn) | GULL WING | 500 µm | QUAD | 1.6 mm | 7 mm | 7 mm | NXP SEMICONDUCTORS | QFP | 48 | SOT313-2 | compliant | NXP | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-313-2, LQFP-48 | 8542.31.00.01 | |||||||||
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MCP2515T-E/ST
Microchip Technology Inc
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$1.5758 | Yes | Yes | Active | CAN, SPI | 0.125 MBps | 40 MHz | YES | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | SYNC; BIT ;BYTE | NRZ | YES | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G20 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 20 | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 6.5 mm | MICROCHIP TECHNOLOGY INC | TSSOP | 20 | compliant | Microchip | 4.40 MM, LEAD FREE, PLASTIC, TSSOP-20 | EAR99 | 8542.39.00.01 | ||||||||||||
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LAN8700C-AEZG-TR
Microchip Technology Inc
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$1.6789 | Yes | Active | 12.5 MBps | 25 MHz | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | ASYNC, BIT; SYNC, BYTE | NRZI; BIPH-LEVEL(MANCHESTER) | YES | 4 | 41.3 mA | 3.6 V | 3 V | COMMERCIAL | S-PQCC-N36 | Not Qualified | e3 | 70 °C | TS 16949 | 36 | PLASTIC/EPOXY | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | QFN | 36 | compliant | Microchip | 6 X 6 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-36 | EAR99 | 8542.39.00.01 | ||||||||||||||
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USB3280-AEZG-TR
Microchip Technology Inc
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$1.7050 | Yes | Active | USB | 8 | 60 MBps | 24 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | 24 MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE | NO | ASYNC, BIT; SYNC, BYTE | NRZI | YES | 2 | 3.6 V | 3 V | INDUSTRIAL | S-PQCC-N36 | e3 | 85 °C | -40 °C | TS 16949 | 36 | PLASTIC/EPOXY | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | QFN-36 | EAR99 | 8542.31.00.01 | ||||||||||||||
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LAN8700IC-AEZG-TR
Microchip Technology Inc
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$1.7159 | Yes | Active | 12.5 MBps | 25 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | IT ALSO HAS IEEE802.3AB NETWORK PROTOCOL | NO | SYNC, BYTE; ETHERNET | NRZI; BIPH-LEVEL (MANCHESTER) | YES | 4 | 41.3 mA | 3.6 V | 3 V | INDUSTRIAL | S-PQCC-N36 | e3 | 85 °C | -40 °C | TS 16949 | 36 | PLASTIC/EPOXY | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | QFN-36 | EAR99 | 8542.39.00.01 |