Parametric results for: Other Memory ICs

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AM27S181DM
Rochester Electronics LLC
Check for Price Active 8.192 kbit 8 1KX8 5 V MEMORY CIRCUIT 1 1000 1.024 k ASYNCHRONOUS 5.5 V 4.5 V BIPOLAR MILITARY R-CDIP-T24 125 °C -55 °C NOT SPECIFIED NOT SPECIFIED 24 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL ROCHESTER ELECTRONICS LLC DIP, unknown EAR99 8542.32.00.71
MC3242ALDS
Freescale Semiconductor
Check for Price No Obsolete BIPOLAR COMMERCIAL R-XDIP-T28 e0 70 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL MOTOROLA SEMICONDUCTOR PRODUCTS DIP, DIP28,.6 unknown EAR99 8542.32.00.71
AM27S21LMB
AMD
Check for Price No Obsolete 1.024 kbit 4 256X4 5 V 60 ns MEMORY CIRCUIT 1 256 256 words ASYNCHRONOUS 130 µA 5.5 V 4.5 V BIPOLAR MILITARY R-CQCC-N20 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B (Modified) 20 CERAMIC, METAL-SEALED COFIRED QCCN LCC20,.35SQ RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD ADVANCED MICRO DEVICES INC QCCN, LCC20,.35SQ unknown EAR99 8542.32.00.71 QLCC 20
AM27S181ALMB
AMD
Check for Price Yes No Obsolete 8.192 kbit 8 1KX8 5 V 50 ns MEMORY CIRCUIT 1 1000 1.024 k ASYNCHRONOUS 5.5 V 4.5 V BIPOLAR MILITARY R-CQCC-N32 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B (Modified) 32 CERAMIC, METAL-SEALED COFIRED QCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD ADVANCED MICRO DEVICES INC QCCN, LCC32,.45X.55 compliant EAR99 8542.32.00.71 QFJ 32
QP7C245A-18WC
e2v technologies
Check for Price Active 16.384 kbit 8 2KX8 5 V 18 ns UVPROM COMMON 1 2000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 5 V 120 µA 5.5 V 4.5 V BIPOLAR R-GDIP-T24 70 °C 24 CERAMIC, GLASS-SEALED WDIP DIP24,.3 RECTANGULAR IN-LINE, WINDOW NO THROUGH-HOLE 2.54 mm DUAL 5.08 mm 32.51 mm 7.62 mm E2V TECHNOLOGIES PLC , compliant EAR99 8542.32.00.61
HM-7602-5
Intersil Corporation
Check for Price Obsolete 256 bit 8 32X8 5 V MEMORY CIRCUIT 1 32 32 words ASYNCHRONOUS 5.25 V 4.75 V BIPOLAR COMMERCIAL R-PDIP-T16 Not Qualified 70 °C 16 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.33 mm 19.17 mm 7.62 mm INTERSIL CORP DIP, unknown EAR99 8542.32.00.71 DIP 16
DS1646W/883B
Texas Instruments
Check for Price No Obsolete BIPOLAR MILITARY R-XDFP-F16 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 16 CERAMIC DFP FL16,.3 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) FLAT 1.27 mm DUAL NATIONAL SEMICONDUCTOR CORP DFP, FL16,.3 unknown EAR99 8542.32.00.71
S82S141F883C
NXP Semiconductors
Check for Price No Obsolete 4.096 kbit 8 512X8 5 V 90 ns MEMORY CIRCUIT 1 512 512 words ASYNCHRONOUS 185 µA 5.5 V 4.5 V BIPOLAR MILITARY R-CDIP-T24 Not Qualified e0 125 °C -55 °C MIL-STD-883 24 CERAMIC, METAL-SEALED COFIRED DIP DIP24,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL SIGNETICS CORP DIP, DIP24,.6 unknown EAR99 8542.32.00.71 DIP 24
MC3242APS
Motorola Semiconductor Products
Check for Price No Obsolete BIPOLAR COMMERCIAL R-PDIP-T28 Not Qualified e0 70 °C 28 PLASTIC/EPOXY DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL MOTOROLA INC unknown EAR99 8542.32.00.71
DS1676J/883C
Texas Instruments
Check for Price No Obsolete BIPOLAR MILITARY R-XDIP-T16 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class C 16 CERAMIC DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL NATIONAL SEMICONDUCTOR CORP DIP, DIP16,.3 unknown EAR99 8542.32.00.71