Part Details for AM27S181ALMB by AMD
Overview of AM27S181ALMB by AMD
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Part Details for AM27S181ALMB
AM27S181ALMB CAD Models
AM27S181ALMB Part Data Attributes:
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AM27S181ALMB
AMD
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Datasheet
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AM27S181ALMB
AMD
Memory Circuit, 1KX8, Bipolar, CQCC32, CERAMIC, LCC-32
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| Pbfree Code | Yes | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | QFJ | |
| Package Description | QCCN, LCC32,.45X.55 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 50 ns | |
| JESD-30 Code | R-CQCC-N32 | |
| JESD-609 Code | e0 | |
| Memory Density | 8192 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 1024 words | |
| Number of Words Code | 1000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 1KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCN | |
| Package Equivalence Code | LCC32,.45X.55 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B (Modified) | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD |