Part Details for WS27C256L-12DMB by Waferscale Integration Inc
Overview of WS27C256L-12DMB by Waferscale Integration Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| PAL22V10-12DM/BV | Rochester Electronics | PAL22V10 - 24 Pin TTL/CMOS Versatile PAL Device | |
| PAL22V10-12DM/B | Rochester Electronics | PAL20L10 - Electrically Erasable PAL Device |
Part Details for WS27C256L-12DMB
WS27C256L-12DMB CAD Models
WS27C256L-12DMB Part Data Attributes
|
|
WS27C256L-12DMB
Waferscale Integration Inc
Buy Now
Datasheet
|
Compare Parts:
WS27C256L-12DMB
Waferscale Integration Inc
UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WAFERSCALE INTEGRATION INC | |
| Package Description | 0.600 INCH, CERDIP-28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 120 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM CARD | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.051 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for WS27C256L-12DMB
This table gives cross-reference parts and alternative options found for WS27C256L-12DMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS27C256L-12DMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8606316XA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | WS27C256L-12DMB vs 5962-8606316XA |
| 5962-8606316XX | UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | WS27C256L-12DMB vs 5962-8606316XX |
| CY27C256-120WI | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | WS27C256L-12DMB vs CY27C256-120WI |
| 5962-8606316XX | UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | WS27C256L-12DMB vs 5962-8606316XX |
| 5662-8606316YA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | WS27C256L-12DMB vs 5662-8606316YA |
| CY27C256-120WMB | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | WS27C256L-12DMB vs CY27C256-120WMB |
| 5662-860636YA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | WS27C256L-12DMB vs 5662-860636YA |
| 5962-8606316XA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28 | Micross Components | WS27C256L-12DMB vs 5962-8606316XA |
| AS27C256A-12JI | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | WS27C256L-12DMB vs AS27C256A-12JI |
| QP27C256-120/YA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | WS27C256L-12DMB vs QP27C256-120/YA |