WS27C256L-12DMB vs AS27C256A-12JI feature comparison

WS27C256L-12DMB Waferscale Integration Inc

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AS27C256A-12JI Micross Components

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC AUSTIN SEMICONDUCTOR INC
Package Description 0.600 INCH, CERDIP-28 0.600 INCH, CERAMIC, DIP-28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 120 ns 120 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-CDIP-T28
JESD-609 Code e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM CARD UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Standby Current-Max 0.0001 A
Supply Current-Max 0.051 mA 0.001 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Part Package Code DIP
Pin Count 28
Seated Height-Max 5.8928 mm
Width 7.62 mm

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