Part Details for 5962-8606316XA by QP Semiconductor
Overview of 5962-8606316XA by QP Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-8606316XA
5962-8606316XA CAD Models
5962-8606316XA Part Data Attributes
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5962-8606316XA
QP Semiconductor
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5962-8606316XA
QP Semiconductor
UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | QP SEMICONDUCTOR INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 120 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 5962-8606316XA
This table gives cross-reference parts and alternative options found for 5962-8606316XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606316XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5662-8606316QYA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | 5962-8606316XA vs 5662-8606316QYA |
| 5962-8606316XA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5962-8606316XA vs 5962-8606316XA |
| WS27C256L-12DMB | 32KX8 UVPROM, 120ns, CDIP28, 0.600 INCH, CERDIP-28 | STMicroelectronics | 5962-8606316XA vs WS27C256L-12DMB |
| AS27C256A-12JM | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | 5962-8606316XA vs AS27C256A-12JM |
| 5962-8606316XX | UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5962-8606316XA vs 5962-8606316XX |
| IS27C256-12CW | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Integrated Silicon Solution Inc | 5962-8606316XA vs IS27C256-12CW |
| 5662-860636YA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | 5962-8606316XA vs 5662-860636YA |
| WS27C256L-12DMB | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Waferscale Integration Inc | 5962-8606316XA vs WS27C256L-12DMB |
| 5662-8606316YA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | 5962-8606316XA vs 5662-8606316YA |
| 5962-8606316XA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28 | Micross Components | 5962-8606316XA vs 5962-8606316XA |