There are no models available for this part yet.
Overview of QD27256-2 by Intel Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for QD27256-2 by Intel Corporation
Part Data Attributes for QD27256-2 by Intel Corporation
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
INTEL CORP
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|
Part Package Code
|
DIP
|
|
Package Description
|
WDIP, DIP28,.6
|
|
Pin Count
|
28
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
200 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-GDIP-T28
|
|
JESD-609 Code
|
e0
|
|
Length
|
37.15 mm
|
|
Memory Density
|
262144 bit
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Memory IC Type
|
UVPROM
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|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
28
|
|
Number of Words
|
32768 words
|
|
Number of Words Code
|
32000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
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Organization
|
32KX8
|
|
Output Characteristics
|
3-STATE
|
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Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
WDIP
|
|
Package Equivalence Code
|
DIP28,.6
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE, WINDOW
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
12.5 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.72 mm
|
|
Supply Current-Max
|
0.1 mA
|
|
Supply Voltage-Max (Vsup)
|
5.25 V
|
|
Supply Voltage-Min (Vsup)
|
4.75 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
NMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
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|
Width
|
15.24 mm
|
Alternate Parts for QD27256-2
This table gives cross-reference parts and alternative options found for QD27256-2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QD27256-2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| FT27C256R-20LM | UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 | Force Technologies Ltd | QD27256-2 vs FT27C256R-20LM |
| FT27C256R-20LMB | UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | Force Technologies Ltd | QD27256-2 vs FT27C256R-20LMB |
| UPD27C256AD-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | NEC Electronics Group | QD27256-2 vs UPD27C256AD-20 |
| QP27C256L-200/XA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | QD27256-2 vs QP27C256L-200/XA |
| QD27C256-200V10 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Intel Corporation | QD27256-2 vs QD27C256-200V10 |
| CY27C256A-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | QD27256-2 vs CY27C256A-200WI |
| NM27C256N200 | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 | Fairchild Semiconductor Corporation | QD27256-2 vs NM27C256N200 |
| WS27C256L-20DMB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Waferscale Integration Inc | QD27256-2 vs WS27C256L-20DMB |
| AM27C256-205DCB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD27256-2 vs AM27C256-205DCB |
| AM27C256-200/BXA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD27256-2 vs AM27C256-200/BXA |