Part Details for UPD27C256AD-20 by NEC Electronics Group
Overview of UPD27C256AD-20 by NEC Electronics Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for UPD27C256AD-20
UPD27C256AD-20 CAD Models
UPD27C256AD-20 Part Data Attributes
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UPD27C256AD-20
NEC Electronics Group
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Datasheet
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UPD27C256AD-20
NEC Electronics Group
UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NEC ELECTRONICS CORP | |
Part Package Code | DIP | |
Package Description | WDIP, | |
Pin Count | 28 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32KX8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for UPD27C256AD-20
This table gives cross-reference parts and alternative options found for UPD27C256AD-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD27C256AD-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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AM27C256-200/BXA | AMD | Check for Price | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | UPD27C256AD-20 vs AM27C256-200/BXA |
NM27C256Q200 | Texas Instruments | Check for Price | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | UPD27C256AD-20 vs NM27C256Q200 |
CY27C256A-200WC | Cypress Semiconductor | Check for Price | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | UPD27C256AD-20 vs CY27C256A-200WC |
NMC27C256BQ20 | Texas Instruments | Check for Price | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | UPD27C256AD-20 vs NMC27C256BQ20 |
MBM27256-20Z | FUJITSU Semiconductor Limited | Check for Price | UVPROM, 32KX8, 200ns, NMOS, CDIP28, CERDIP-28 | UPD27C256AD-20 vs MBM27256-20Z |
AM27256-20DEB | AMD | Check for Price | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | UPD27C256AD-20 vs AM27256-20DEB |
SMJ27C256-20JM | Texas Instruments | Check for Price | 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 | UPD27C256AD-20 vs SMJ27C256-20JM |
NMC27C256BQ200 | Texas Instruments | Check for Price | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | UPD27C256AD-20 vs NMC27C256BQ200 |
SMJ27C256-20JM | Micross Components | Check for Price | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | UPD27C256AD-20 vs SMJ27C256-20JM |