Part Details for QD27C256-200V10 by Intel Corporation
Overview of QD27C256-200V10 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for QD27C256-200V10
QD27C256-200V10 CAD Models
QD27C256-200V10 Part Data Attributes
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QD27C256-200V10
Intel Corporation
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Datasheet
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QD27C256-200V10
Intel Corporation
UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | DIP | |
| Package Description | WINDOWED, CERDIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.15 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.72 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for QD27C256-200V10
This table gives cross-reference parts and alternative options found for QD27C256-200V10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of QD27C256-200V10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C256-200/BXA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | QD27C256-200V10 vs AM27C256-200/BXA |
| NM27C256Q200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | Texas Instruments | QD27C256-200V10 vs NM27C256Q200 |
| CY27C256A-200WC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Cypress Semiconductor | QD27C256-200V10 vs CY27C256A-200WC |
| NMC27C256BQ20 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | QD27C256-200V10 vs NMC27C256BQ20 |
| MBM27256-20Z | UVPROM, 32KX8, 200ns, NMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | QD27C256-200V10 vs MBM27256-20Z |
| AM27256-20DEB | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | QD27C256-200V10 vs AM27256-20DEB |
| SMJ27C256-20JM | 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 | Texas Instruments | QD27C256-200V10 vs SMJ27C256-20JM |
| NMC27C256BQ200 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | QD27C256-200V10 vs NMC27C256BQ200 |
| SMJ27C256-20JM | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Micross Components | QD27C256-200V10 vs SMJ27C256-20JM |
| 27C256-20I/J | 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | QD27C256-200V10 vs 27C256-20I/J |