Part Details for MPC7410THX500LE by Freescale Semiconductor
Overview of MPC7410THX500LE by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for MPC7410THX500LE
MPC7410THX500LE CAD Models
MPC7410THX500LE Part Data Attributes
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MPC7410THX500LE
Freescale Semiconductor
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Datasheet
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MPC7410THX500LE
Freescale Semiconductor
32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 | |
Pin Count | 360 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.1 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 133 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B360 | |
JESD-609 Code | e0 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 360 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Equivalence Code | BGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.2 mm | |
Speed | 500 MHz | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC7410THX500LE
This table gives cross-reference parts and alternative options found for MPC7410THX500LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC7410THX500LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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PCX7410VGSU500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 | Teledyne e2v | MPC7410THX500LE vs PCX7410VGSU500LE |
MPC7410HX500LE | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | MPC7410THX500LE vs MPC7410HX500LE |
MPC7410THX500LE | 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 | Motorola Mobility LLC | MPC7410THX500LE vs MPC7410THX500LE |
MPC7410RX500LC | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Semiconductor Products | MPC7410THX500LE vs MPC7410RX500LC |
MPC7410TRX500LE | 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | MPC7410THX500LE vs MPC7410TRX500LE |
MPC7410HX500LE | NT HITCE RV1.4,1.8V,105C | Freescale Semiconductor | MPC7410THX500LE vs MPC7410HX500LE |
PC7410MGHU500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Teledyne e2v | MPC7410THX500LE vs PC7410MGHU500LE |
MPC7410RX500LD | 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | MPC7410THX500LE vs MPC7410RX500LD |
PCX7410VGU500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | MPC7410THX500LE vs PCX7410VGU500LE |
PC7410MG500LE | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Teledyne e2v | MPC7410THX500LE vs PC7410MG500LE |