MPC7410THX500LE vs MPC7410HX500LE feature comparison

MPC7410THX500LE Freescale Semiconductor

Buy Now Datasheet

MPC7410HX500LE Freescale Semiconductor

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
Pin Count 360 360
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.1 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 133 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-CBGA-B360
JESD-609 Code e0 e0
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1 1
Number of Terminals 360 360
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA HBGA
Package Equivalence Code BGA360,19X19,50 BGA360,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.2 mm
Speed 500 MHz 500 MHz
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare MPC7410THX500LE with alternatives

Compare MPC7410HX500LE with alternatives