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Microcontrollers and Processors / Microprocessors / PCX7410VGSU500LE
Datasheets
PCX7410VGSU500LE by:

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360

Part Details for PCX7410VGSU500LE by Teledyne e2v

Overview of PCX7410VGSU500LE by Teledyne e2v

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Applications Space Technology Industrial Automation Aerospace and Defense Transportation and Logistics Renewable Energy Automotive Robotics and Drones

Part Details for PCX7410VGSU500LE

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PCX7410VGSU500LE Part Data Attributes

Parametric Data
PCX7410VGSU500LE Teledyne e2v
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PCX7410VGSU500LE Teledyne e2v RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360
Part Life Cycle Code Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 133 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.2 mm
Speed 500 MHz
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PCX7410VGSU500LE

This table gives cross-reference parts and alternative options found for PCX7410VGSU500LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX7410VGSU500LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MPC7410HX500LE 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PCX7410VGSU500LE vs MPC7410HX500LE
MPC7410THX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 Motorola Mobility LLC PCX7410VGSU500LE vs MPC7410THX500LE
MPC7410RX500LC RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Semiconductor Products PCX7410VGSU500LE vs MPC7410RX500LC
MPC7410TRX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor PCX7410VGSU500LE vs MPC7410TRX500LE
MPC7410HX500LE NT HITCE RV1.4,1.8V,105C Freescale Semiconductor PCX7410VGSU500LE vs MPC7410HX500LE
PC7410MGHU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410MGHU500LE
MPC7410RX500LD 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor PCX7410VGSU500LE vs MPC7410RX500LD
PCX7410VGU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PCX7410VGU500LE
PC7410MG500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410MG500LE
PC7410MGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PCX7410VGSU500LE vs PC7410MGSU500LE
Part Number Description Manufacturer Compare
PC7410VG500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410VG500LE
MPC7410TRX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor PCX7410VGSU500LE vs MPC7410TRX500LE
PC7410VGS500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410VGS500LE
PC7410MGHU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410MGHU500LE
PC7410VGHU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410VGHU500LE
PC7410VG500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410VG500NE
PC7410MG500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410MG500NE
MPC7410VS500LE 32-BIT, 500MHz, RISC PROCESSOR, CLGA360 NXP Semiconductors PCX7410VGSU500LE vs MPC7410VS500LE
PC7410VGS500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410VGS500NE
PC7410MGU500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PCX7410VGSU500LE vs PC7410MGU500NE

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