Part Details for HM66AQB9402BP-60 by Renesas Electronics Corporation
Overview of HM66AQB9402BP-60 by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for HM66AQB9402BP-60
HM66AQB9402BP-60 CAD Models
HM66AQB9402BP-60 Part Data Attributes:
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HM66AQB9402BP-60
Renesas Electronics Corporation
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Datasheet
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HM66AQB9402BP-60
Renesas Electronics Corporation
4MX9 QDR SRAM, 0.5ns, PBGA165, PLASTIC, FBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS TECHNOLOGY CORP | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.5 ns | |
| Clock Frequency-Max (fCLK) | 167 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 17 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 9 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4MX9 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.46 mm | |
| Standby Current-Max | 0.26 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.55 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for HM66AQB9402BP-60
This table gives cross-reference parts and alternative options found for HM66AQB9402BP-60. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM66AQB9402BP-60, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8662D19BD-300I | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | HM66AQB9402BP-60 vs GS8662D19BD-300I |
| IS61QDPB24M18A-300M3LI | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | HM66AQB9402BP-60 vs IS61QDPB24M18A-300M3LI |
| GS8672D19BE-375T | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | HM66AQB9402BP-60 vs GS8672D19BE-375T |
| GS8662DT20BGD-500I | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | HM66AQB9402BP-60 vs GS8662DT20BGD-500I |
| GS8662T20BGD-350T | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | HM66AQB9402BP-60 vs GS8662T20BGD-350T |
| MT57W4MH9JF-7.5 | DDR SRAM, 4MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | Micron Technology Inc | HM66AQB9402BP-60 vs MT57W4MH9JF-7.5 |
| CY7C1426V18-250BZC | QDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 | Cypress Semiconductor | HM66AQB9402BP-60 vs CY7C1426V18-250BZC |
| IS61QDP2B44M18A-333M3I | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | HM66AQB9402BP-60 vs IS61QDP2B44M18A-333M3I |
| GS81302D19AGE-400 | DDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | HM66AQB9402BP-60 vs GS81302D19AGE-400 |
| UPD44324094F5-E33-EQ2 | DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165 | NEC Electronics Group | HM66AQB9402BP-60 vs UPD44324094F5-E33-EQ2 |