HM66AQB9402BP-60
vs
GS8662D19BD-300I
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
GSI TECHNOLOGY
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA, BGA165,11X15,40
|
LBGA,
|
| Pin Count |
165
|
165
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.B
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
0.5 ns
|
0.45 ns
|
| Clock Frequency-Max (fCLK) |
167 MHz
|
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
| Length |
17 mm
|
15 mm
|
| Memory Density |
37748736 bit
|
75497472 bit
|
| Memory IC Type |
QDR SRAM
|
DDR SRAM
|
| Memory Width |
9
|
18
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
165
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
4MX9
|
4MX18
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA165,11X15,40
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.46 mm
|
1.4 mm
|
| Standby Current-Max |
0.26 A
|
|
| Standby Voltage-Min |
1.7 V
|
|
| Supply Current-Max |
0.55 mA
|
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
15 mm
|
13 mm
|
| Base Number Matches |
1
|
2
|
| Factory Lead Time |
|
24 Weeks
|
| Additional Feature |
|
PIPELINE ARCHITECTURE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HM66AQB9402BP-60 with alternatives
Compare GS8662D19BD-300I with alternatives