HM66AQB9402BP-60 vs UPD44324094F5-E33-EQ2 feature comparison

HM66AQB9402BP-60 Renesas Electronics Corporation

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UPD44324094F5-E33-EQ2 NEC Electronics Group

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP NEC ELECTRONICS CORP
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 BGA,
Pin Count 165 165
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.5 ns 0.45 ns
Clock Frequency-Max (fCLK) 167 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 15 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type QDR SRAM DDR SRAM
Memory Width 9 9
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX9 4MX9
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.46 mm
Standby Current-Max 0.26 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.55 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 13 mm
Base Number Matches 1 1
Additional Feature PIPELINED ARCHITECTURE

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Compare UPD44324094F5-E33-EQ2 with alternatives