HM66AQB9402BP-60 vs IS61QDPB24M18A-300M3LI feature comparison

HM66AQB9402BP-60 Renesas Electronics Corporation

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IS61QDPB24M18A-300M3LI Integrated Silicon Solution Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS TECHNOLOGY CORP INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 LBGA, BGA165,11X15,40
Pin Count 165 165
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.5 ns 0.45 ns
Clock Frequency-Max (fCLK) 167 MHz 300 MHz
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 17 mm
Memory Density 37748736 bit 75497472 bit
Memory IC Type QDR SRAM QDR SRAM
Memory Width 9 18
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX9 4MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.46 mm 1.4 mm
Standby Current-Max 0.26 A 0.28 A
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.55 mA 1.05 mA
Supply Voltage-Max (Vsup) 1.9 V 1.89 V
Supply Voltage-Min (Vsup) 1.7 V 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 1 1
Additional Feature PIPELINED ARCHITECTURE

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Compare IS61QDPB24M18A-300M3LI with alternatives