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Programmable Logic Programmable Logic Devices EPM2210F256C4

EPM2210F256C4
Description: Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256

Overview of EPM2210F256C4 by Intel Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Computing and Data Storage Telecommunications

Price & Stock for EPM2210F256C4 by Intel Corporation

Part # Manufacturer Description Stock Price Buy
DISTI # 544-1340-ND
DigiKey IC CPLD 1700MC 7NS 256FBGA Min Qty: 90 Lead time: 26 Weeks Container: Tray Temporarily Out of Stock
  • 90 $105.6607
$105.6607 Buy Now
Win Source Electronics IC CPLD 1700MC 7NS 256FBGA 3577
  • 2 $43.6570
  • 3 $35.8210
  • 5 $34.7020
  • 6 $33.5830
  • 8 $32.4630
  • 11 $29.1050
$29.1050 / $43.6570 Buy Now

CAD Models for EPM2210F256C4 by Intel Corporation
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Part Data Attributes for EPM2210F256C4 by Intel Corporation
Parametric Data

EPM2210F256C4
Intel Corporation
Buy Now
-
-
Rohs Code
No
Part Life Cycle Code
Active
Ihs Manufacturer
INTEL CORP
Package Description
17 X 17 MM, 1 MM PITCH, FBGA-256
Reach Compliance Code
not_compliant
ECCN Code
3A991
HTS Code
8542.39.00.01
Samacsys Manufacturer
Intel
Additional Feature
IT CAN ALSO OPERATE AT 3.3V
In-System Programmable
YES
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
JTAG BST
YES
Length
17 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
Number of I/O Lines
204
Number of Inputs
204
Number of Macro Cells
1700
Number of Outputs
204
Number of Terminals
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 204 I/O
Output Function
MACROCELL
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
FLASH PLD
Propagation Delay
9.1 ns
Qualification Status
Not Qualified
Seated Height-Max
2.2 mm
Supply Voltage-Max
2.625 V
Supply Voltage-Min
2.375 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL EXTENDED
Terminal Finish
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
17 mm
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  1. EPM2210F256C4
    Intel Corporation
    Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256
    VS

Alternate Parts for EPM2210F256C4

This table gives cross-reference parts and alternative options found for EPM2210F256C4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPM2210F256C4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
EPM2210F256C4 Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 Altera Corporation EPM2210F256C4 vs EPM2210F256C4
EPM2210F256C4N Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 Intel Corporation EPM2210F256C4 vs EPM2210F256C4N
EPM2210F256I4 Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256 Altera Corporation EPM2210F256C4 vs EPM2210F256I4
EPM2210F256A4 Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256, Intel Corporation EPM2210F256C4 vs EPM2210F256A4
EPM2210F256A4N Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 Intel Corporation EPM2210F256C4 vs EPM2210F256A4N
EPM2210F256A4 Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256 Altera Corporation EPM2210F256C4 vs EPM2210F256A4
Part Number Description Manufacturer Compare
EPM2210F256A5N Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 Altera Corporation EPM2210F256C4 vs EPM2210F256A5N
EPM2210F256C3 Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 Altera Corporation EPM2210F256C4 vs EPM2210F256C3
EPM2210F256I3N Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 Intel Corporation EPM2210F256C4 vs EPM2210F256I3N
EPM2210F256A4 Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256, Intel Corporation EPM2210F256C4 vs EPM2210F256A4
EPM2210F256I5N Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 Intel Corporation EPM2210F256C4 vs EPM2210F256I5N
EPM2210F256I4N Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 Intel Corporation EPM2210F256C4 vs EPM2210F256I4N
EPM2210F256I5 Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 Altera Corporation EPM2210F256C4 vs EPM2210F256I5
EPM2210F256A4N Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 Intel Corporation EPM2210F256C4 vs EPM2210F256A4N
EPM2210F256C3 Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 Intel Corporation EPM2210F256C4 vs EPM2210F256C3
EPM2210F256I5N Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 Altera Corporation EPM2210F256C4 vs EPM2210F256I5N

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