EPM2210F256C4
vs
EPM2210F256A4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
17 X 17 MM, 1 MM PITCH, FBGA-256
BGA, BGA256,16X16,40
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
Additional Feature
IT CAN ALSO OPERATE AT 3.3V
YES
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
17 mm
Moisture Sensitivity Level
3
1
Number of Dedicated Inputs
Number of I/O Lines
204
Number of Inputs
204
Number of Macro Cells
1700
1700
Number of Outputs
204
Number of Terminals
256
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 204 I/O
Output Function
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
9.1 ns
9.1 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
Supply Voltage-Max
2.625 V
Supply Voltage-Min
2.375 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
17 mm
Base Number Matches
2
2
Pbfree Code
Compare EPM2210F256C4 with alternatives
Compare EPM2210F256A4 with alternatives