Datasheets
DPE512S8N-13B by:

EEPROM Module, 512KX8, 135ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32

Part Details for DPE512S8N-13B by B&B Electronics Manufacturing Company

Overview of DPE512S8N-13B by B&B Electronics Manufacturing Company

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Applications Consumer Electronics Education and Research Environmental Monitoring Industrial Automation Audio and Video Systems Agriculture Technology Medical Imaging Entertainment and Gaming

Part Details for DPE512S8N-13B

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DPE512S8N-13B Part Data Attributes:

DPE512S8N-13B B&B Electronics Manufacturing Company
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DPE512S8N-13B B&B Electronics Manufacturing Company EEPROM Module, 512KX8, 135ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP
Part Package Code MODULE
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 135 ns
Additional Feature DATA RETENTION > 10 YEARS
Data Polling YES
Data Retention Time-Min 10
JESD-30 Code R-CDMA-T32
JESD-609 Code e0
Memory Density 4194304 bit
Memory IC Type EEPROM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Page Size 128 words
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Standby Current-Max 0.003 A
Supply Current-Max 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Toggle Bit NO
Write Cycle Time-Max (tWC) 10 ms
Write Protection SOFTWARE

Alternate Parts for DPE512S8N-13B

This table gives cross-reference parts and alternative options found for DPE512S8N-13B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPE512S8N-13B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DPE512S8N-13M EEPROM Module, 512KX8, 135ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-13M
DPE512S8N-13C EEPROM Module, 512KX8, 135ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-13C
Part Number Description Manufacturer Compare
DPE512S8N-13M EEPROM Module, 512KX8, 135ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-13M
DPE512S8N-30M EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-30M
DPE512S8N-17B EEPROM Module, 512KX8, 170ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-17B
DPE512S8N-13C EEPROM Module, 512KX8, 135ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-13C
DPE512S8N-30C EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-30C
DPE512S8N-25M EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-25M
DPE512S8N-25C EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-25C
DPE512S8N-30B EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-30B
DPE512S8N-17I EEPROM Module, 512KX8, 170ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-17I
DPE512S8N-25B EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 B&B Electronics Manufacturing Company DPE512S8N-13B vs DPE512S8N-25B

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