Part Details for DPE512S8N-25M by B&B Electronics Manufacturing Company
Overview of DPE512S8N-25M by B&B Electronics Manufacturing Company
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (8 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
LPS6225-105MLC | Coilcraft Inc | General Purpose Inductor, 1000uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-25M, CHIP, 6262-25M, ROHS COMPLIANT | |
LPS6225-154MLC | Coilcraft Inc | General Purpose Inductor, 150uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-25M, CHIP, 6262-25M, ROHS COMPLIANT | |
LPS6225-224MLC | Coilcraft Inc | General Purpose Inductor, 220uH, 20%, 1 Element, Ferrite-Core, SMD, 6262-25M, CHIP, 6262-25M, ROHS COMPLIANT |
Part Details for DPE512S8N-25M
DPE512S8N-25M CAD Models
DPE512S8N-25M Part Data Attributes
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DPE512S8N-25M
B&B Electronics Manufacturing Company
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Datasheet
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DPE512S8N-25M
B&B Electronics Manufacturing Company
EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
Part Package Code | MODULE | |
Package Description | DIP, DIP32,.6 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 250 ns | |
Additional Feature | DATA RETENTION > 10 YEARS | |
Data Polling | YES | |
Data Retention Time-Min | 10 | |
JESD-30 Code | R-CDMA-T32 | |
JESD-609 Code | e0 | |
Memory Density | 4194304 bit | |
Memory IC Type | EEPROM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 512KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Equivalence Code | DIP32,.6 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Page Size | 128 words | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.003 A | |
Supply Current-Max | 0.09 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Toggle Bit | NO | |
Write Cycle Time-Max (tWC) | 10 ms | |
Write Protection | SOFTWARE |
Alternate Parts for DPE512S8N-25M
This table gives cross-reference parts and alternative options found for DPE512S8N-25M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPE512S8N-25M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
DPE512S8N-17M | EEPROM Module, 512KX8, 170ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | DPE512S8N-25M vs DPE512S8N-17M |
DPE512S8N-17I | EEPROM Module, 512KX8, 170ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | DPE512S8N-25M vs DPE512S8N-17I |
DPE512S8N-13C | EEPROM Module, 512KX8, 135ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | DPE512S8N-25M vs DPE512S8N-13C |
DPE512S8N-30C | EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | DPE512S8N-25M vs DPE512S8N-30C |
DPE512S8N-13M | EEPROM Module, 512KX8, 135ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | DPE512S8N-25M vs DPE512S8N-13M |
DPE512S8N-13B | EEPROM Module, 512KX8, 135ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | DPE512S8N-25M vs DPE512S8N-13B |
DPE512S8N-17B | EEPROM Module, 512KX8, 170ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | DPE512S8N-25M vs DPE512S8N-17B |
DPE512S8N-30M | EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | DPE512S8N-25M vs DPE512S8N-30M |