Part Details for AS6C8016-55BIN by Alliance Memory Inc
Overview of AS6C8016-55BIN by Alliance Memory Inc
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for AS6C8016-55BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
85AK7299
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Newark | Lp Sram, 8Mb, 512K X 16, 2.7 3.6V, 48Ball Tfbga (6X8Mm) (One Chip Select Pin:B5), 55Ns, Industrial Temp |Alliance Memory AS6C8016-55BIN Min Qty: 480 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$7.8000 / $8.0000 | Buy Now |
|
DISTI #
1450-1040-ND
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DigiKey | IC SRAM 8MBIT PARALLEL 48TFBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
682 In Stock |
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$5.7591 / $8.0300 | Buy Now |
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DISTI #
AS6C8016-55BIN
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Avnet Americas | SRAM Chip Async Single 3V 8M-Bit 512K x 16 55ns 48-Pin TFBGA - Trays (Alt: AS6C8016-55BIN) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$7.2000 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 480 Package Multiple: 480 Container: Tray | 0Tray |
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$5.0000 | Buy Now |
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DISTI #
AS6C8016-55BIN
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Avnet Americas | SRAM Chip Async Single 3V 8M-Bit 512K x 16 55ns 48-Pin TFBGA - Trays (Alt: AS6C8016-55BIN) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
$7.2000 | Buy Now |
|
DISTI #
AS6C8016-55BIN
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Avnet Americas | SRAM Chip Async Single 3V 8M-Bit 512K x 16 55ns 48-Pin TFBGA - Trays (Alt: AS6C8016-55BIN) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
$7.2000 | Buy Now |
|
DISTI #
AS6C8016-55BIN
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Avnet Silica | SRAM Chip Async Single 3V 8M-Bit 512K x 16 55ns 48-Pin TFBGA (Alt: AS6C8016-55BIN) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 2 Weeks, 3 Days | Silica - 0 |
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Buy Now | |
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Chip1Cloud | IC SRAM 8MBIT 55NS 48TFBGA | 2570 |
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RFQ |
Part Details for AS6C8016-55BIN
AS6C8016-55BIN CAD Models
AS6C8016-55BIN Part Data Attributes
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AS6C8016-55BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS6C8016-55BIN
Alliance Memory Inc
Standard SRAM, 512KX16, 55ns, CMOS, PBGA48, 6 X 8 MM, GREEN, MO-207, TFBGA-48
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Part Package Code | DSBGA | |
| Package Description | TFBGA, BGA48,6X8,30 | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B48 | |
| Length | 8 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA48,6X8,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.00005 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm |
Alternate Parts for AS6C8016-55BIN
This table gives cross-reference parts and alternative options found for AS6C8016-55BIN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS6C8016-55BIN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY62157EV30LL-45BVXAT | Standard SRAM, 512KX16, 45ns, CMOS, PBGA48, VFBGA-48 | Infineon Technologies AG | AS6C8016-55BIN vs CY62157EV30LL-45BVXAT |
| IS62WV51216BLL-55BLI | Standard SRAM, 512KX16, 55ns, CMOS, PBGA48, 7.20 X 8.70 MM, LEAD FREE, MINI, BGA-48 | Integrated Silicon Solution Inc | AS6C8016-55BIN vs IS62WV51216BLL-55BLI |
| CY62157EV30LL-45BVXA | Standard SRAM, 512KX16, 45ns, CMOS, PBGA48, VFBGA-48 | Infineon Technologies AG | AS6C8016-55BIN vs CY62157EV30LL-45BVXA |
| CY62157EV30LL-45BVIT | Standard SRAM, 512KX16, 45ns, CMOS, PBGA48, VFBGA-48 | Infineon Technologies AG | AS6C8016-55BIN vs CY62157EV30LL-45BVIT |
| IS64WV51216BLL-10MLA3 | Standard SRAM, 512KX16, 10ns, CMOS, PBGA48, 9 X 11 MM, LEAD FREE, MINI, BGA-48 | Integrated Silicon Solution Inc | AS6C8016-55BIN vs IS64WV51216BLL-10MLA3 |
| IS62WV51216ALL-70BLI | Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, 7.20 X 8.70 MM, LEAD FREE, MINI, BGA-48 | Integrated Silicon Solution Inc | AS6C8016-55BIN vs IS62WV51216ALL-70BLI |
| IS61WV51216BLL-10MLI | Standard SRAM, 512KX16, 10ns, CMOS, PBGA48, 9 X 11 MM, LEAD FREE, MINI, BGA-48 | Integrated Silicon Solution Inc | AS6C8016-55BIN vs IS61WV51216BLL-10MLI |