Memory
AM27256-2PC
Description: OTP ROM, 32KX8, 200ns, NMOS, PDIP28, PLASTIC, DIP-28

Overview of AM27256-2PC by AMD

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Where used in Applications: Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

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Part Data Attributes for AM27256-2PC by AMD

AM27256-2PC
AMD
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
Package Description
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
200 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T28
JESD-609 Code
e0
Length
37.084 mm
Memory Density
262144 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Programming Voltage
12.5 V
Qualification Status
Not Qualified
Seated Height-Max
5.715 mm
Supply Current-Max
0.1 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
NMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Want to compare parts?
  1. AM27256-2PC
    AMD
    OTP ROM, 32KX8, 200ns, NMOS, PDIP28, PLASTIC, DIP-28
    VS

Alternate Parts for AM27256-2PC

This table gives cross-reference parts and alternative options found for AM27256-2PC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27256-2PC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
5962-8606311UA UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor AM27256-2PC vs 5962-8606311UA
5962-8606311UX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v AM27256-2PC vs 5962-8606311UX
NM27LC256Q200 IC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation AM27256-2PC vs NM27LC256Q200
NM27C256NE200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation AM27256-2PC vs NM27C256NE200
CY27C256-200WC UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Cypress Semiconductor AM27256-2PC vs CY27C256-200WC
NMC27C256BN200 32KX8 OTPROM, 200ns, PDIP28, PLASTIC, DIP-28 Texas Instruments AM27256-2PC vs NMC27C256BN200
27C256MQB/C20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v AM27256-2PC vs 27C256MQB/C20
TMX27PC256-2NL 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments AM27256-2PC vs TMX27PC256-2NL
27C256MQB/C20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Thales Group AM27256-2PC vs 27C256MQB/C20
AM27C256-200PI OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28 Spansion AM27256-2PC vs AM27C256-200PI
Part Number Description Manufacturer Compare
FT27C256R-20LM UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd AM27256-2PC vs FT27C256R-20LM
FT27C256R-20LMB UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Force Technologies Ltd AM27256-2PC vs FT27C256R-20LMB
UPD27C256AD-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 NEC Electronics Group AM27256-2PC vs UPD27C256AD-20
QP27C256L-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v AM27256-2PC vs QP27C256L-200/XA
QD27C256-200V10 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Intel Corporation AM27256-2PC vs QD27C256-200V10
CY27C256A-200WI UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor AM27256-2PC vs CY27C256A-200WI
NM27C256N200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation AM27256-2PC vs NM27C256N200
WS27C256L-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Waferscale Integration Inc AM27256-2PC vs WS27C256L-20DMB
AM27C256-205DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-2PC vs AM27C256-205DCB
AM27C256-200/BXA UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-2PC vs AM27C256-200/BXA

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