Memory
WME128K8-200CQ
Description: EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32

Overview of WME128K8-200CQ by Microsemi Corporation

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Part Data Attributes for WME128K8-200CQ by Microsemi Corporation

WME128K8-200CQ
Microsemi Corporation
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Transferred
Ihs Manufacturer
MICROSEMI CORP
Part Package Code
DIP
Package Description
0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Pin Count
32
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Access Time-Max
200 ns
Additional Feature
HARDWARE AND SOFTWARE DATA PROTECTION
JESD-30 Code
R-CDIP-T32
JESD-609 Code
e4
Memory Density
1048576 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.5 mm
Terminal Position
DUAL
Write Cycle Time-Max (tWC)
10 ms
Want to compare parts?
  1. WME128K8-200CQ
    Microsemi Corporation
    EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
    VS

Alternate Parts for WME128K8-200CQ

This table gives cross-reference parts and alternative options found for WME128K8-200CQ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WME128K8-200CQ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
WME128K8-200CMA EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WME128K8-200CQ vs WME128K8-200CMA
WE128K8200CI EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WME128K8-200CQ vs WE128K8200CI
WE128K8200CM EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WME128K8-200CQ vs WE128K8200CM
WME128K8-200CM EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WME128K8-200CQ vs WME128K8-200CM
WME128K8-200CQEA EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WME128K8-200CQ vs WME128K8-200CQEA
WME128K8-200CCA EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WME128K8-200CQ vs WME128K8-200CCA
WE128K8200CMA EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WME128K8-200CQ vs WE128K8200CMA
CM28C010-200/B EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32 LSI Corporation WME128K8-200CQ vs CM28C010-200/B
5962-9315401HXX EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, SINGLE CAVITY, CERAMIC, DIP-32 Microsemi Corporation WME128K8-200CQ vs 5962-9315401HXX
WME128K8-200CMA EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc WME128K8-200CQ vs WME128K8-200CMA
Part Number Description Manufacturer Compare
28C010TRPDI-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 Data Device Corporation WME128K8-200CQ vs 28C010TRPDI-20
TT28HT010N-20EM EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, CERAMIC, SIDE BRAZED, DIP-32 Twilight Technology Inc WME128K8-200CQ vs TT28HT010N-20EM
X28C010CM-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, SIDE BRAZED, DIP-32 Xicor Inc WME128K8-200CQ vs X28C010CM-20
FM28C010-200/B EEPROM, 128KX8, 200ns, Parallel, CMOS, CDFP32 LSI Corporation WME128K8-200CQ vs FM28C010-200/B
28C010TRT4DE-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 Data Device Corporation WME128K8-200CQ vs 28C010TRT4DE-20
FT28C010-20LMB EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC44, CERAMIC, LCC-44 Force Technologies Ltd WME128K8-200CQ vs FT28C010-20LMB
AS28C010CW-20/XT EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, CERDIP-32 Micross Components WME128K8-200CQ vs AS28C010CW-20/XT
FT28C010-20EMB-AT EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd WME128K8-200CQ vs FT28C010-20EMB-AT
28C011TRT2FS-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, LDFP-32 Data Device Corporation WME128K8-200CQ vs 28C011TRT2FS-20
FT28C010-20G-X EEPROM, 128KX8, 200ns, Parallel, CMOS, CPGA36, CERAMIC, PGA-36 Force Technologies Ltd WME128K8-200CQ vs FT28C010-20G-X

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