Datasheets
28C010TRPDI-20 by:

EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32

Part Details for 28C010TRPDI-20 by Data Device Corporation

Overview of 28C010TRPDI-20 by Data Device Corporation

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications Renewable Energy Robotics and Drones

Part Details for 28C010TRPDI-20

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28C010TRPDI-20 Part Data Attributes

28C010TRPDI-20 Data Device Corporation
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28C010TRPDI-20 Data Device Corporation EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32
Part Life Cycle Code Active
Ihs Manufacturer DATA DEVICE CORP
Package Description DIP-32
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 200 ns
JESD-30 Code R-XDIP-T32
Length 40.64 mm
Memory Density 1048576 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Package Body Material UNSPECIFIED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Total Dose 100k Rad(Si) V
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for 28C010TRPDI-20

This table gives cross-reference parts and alternative options found for 28C010TRPDI-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 28C010TRPDI-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
W29EE011-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Winbond Electronics Corp 28C010TRPDI-20 vs W29EE011-20
AS28C010CW-20/883C EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components 28C010TRPDI-20 vs AS28C010CW-20/883C
5962-3826703MXC EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32 LSI Corporation 28C010TRPDI-20 vs 5962-3826703MXC
5962-9315401HXA EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, SINGLE CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Mercury Systems Inc 28C010TRPDI-20 vs 5962-9315401HXA
FT28C010-20DI-X EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Force Technologies Ltd 28C010TRPDI-20 vs FT28C010-20DI-X
FT28C010-20DMB-X EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Force Technologies Ltd 28C010TRPDI-20 vs FT28C010-20DMB-X
5962-9315401HXC EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, SINGLE CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 White Microelectronics 28C010TRPDI-20 vs 5962-9315401HXC
28C010TRPDE-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 Data Device Corporation 28C010TRPDI-20 vs 28C010TRPDE-20
X28C010PM-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, PDIP32, PLASTIC, DIP-32 Xicor Inc 28C010TRPDI-20 vs X28C010PM-20
28C010TRT4DI-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 Data Device Corporation 28C010TRPDI-20 vs 28C010TRT4DI-20
Part Number Description Manufacturer Compare
X28C010D-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 Xicor Inc 28C010TRPDI-20 vs X28C010D-20
28C010TRTDE-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 Maxwell Technologies 28C010TRPDI-20 vs 28C010TRTDE-20
WME128K8-200CIA EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc 28C010TRPDI-20 vs WME128K8-200CIA
FT28C010-20LM-AT EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC44, CERAMIC, LCC-44 Force Technologies Ltd 28C010TRPDI-20 vs FT28C010-20LM-AT
X28C010JI-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 Xicor Inc 28C010TRPDI-20 vs X28C010JI-20
W29EE011-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Winbond Electronics Corp 28C010TRPDI-20 vs W29EE011-20
FT28C010-20F-AT EEPROM, 128KX8, 200ns, Parallel, CMOS, CDFP32, BOTTOM BRAZED, CERAMIC, MO-115, DFP-32 Force Technologies Ltd 28C010TRPDI-20 vs FT28C010-20F-AT
AT28C010-20LM/883 EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC44, CERAMIC, LCC-44 Atmel Corporation 28C010TRPDI-20 vs AT28C010-20LM/883
TT28HT010G-20I EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Twilight Technology Inc 28C010TRPDI-20 vs TT28HT010G-20I
28C010TRT1FE-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, DFP-32 Data Device Corporation 28C010TRPDI-20 vs 28C010TRT1FE-20

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