Part Details for TT28HT010N-20EM by Twilight Technology Inc
Overview of TT28HT010N-20EM by Twilight Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LT3020EMS8-1.5#PBF | Analog Devices | 100mA, L V, Very L Drop Lin Re | |
| LT3020EMS8-1.5#TRPBF | Analog Devices | 100mA, L V, Very L Drop Lin Re | |
| LT3020EMS8-1.2#PBF | Analog Devices | 100mA, L V, Very L Drop Lin Re |
Part Details for TT28HT010N-20EM
TT28HT010N-20EM CAD Models
TT28HT010N-20EM Part Data Attributes
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TT28HT010N-20EM
Twilight Technology Inc
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Datasheet
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TT28HT010N-20EM
Twilight Technology Inc
EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, CERAMIC, SIDE BRAZED, DIP-32
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TWILIGHT TECHNOLOGY INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.A | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-CDIP-T32 | |
| Length | 40.64 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 175 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Seated Height-Max | 4.191 mm | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for TT28HT010N-20EM
This table gives cross-reference parts and alternative options found for TT28HT010N-20EM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TT28HT010N-20EM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W29EE011-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Winbond Electronics Corp | TT28HT010N-20EM vs W29EE011-20 |
| AS28C010CW-20/883C | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Micross Components | TT28HT010N-20EM vs AS28C010CW-20/883C |
| 5962-3826703MXC | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32 | LSI Corporation | TT28HT010N-20EM vs 5962-3826703MXC |
| 5962-9315401HXA | EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, SINGLE CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | Mercury Systems Inc | TT28HT010N-20EM vs 5962-9315401HXA |
| FT28C010-20DI-X | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Force Technologies Ltd | TT28HT010N-20EM vs FT28C010-20DI-X |
| FT28C010-20DMB-X | EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Force Technologies Ltd | TT28HT010N-20EM vs FT28C010-20DMB-X |
| 5962-9315401HXC | EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CDIP32, SINGLE CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | White Microelectronics | TT28HT010N-20EM vs 5962-9315401HXC |
| 28C010TRPDE-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 | Data Device Corporation | TT28HT010N-20EM vs 28C010TRPDE-20 |
| X28C010PM-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, PDIP32, PLASTIC, DIP-32 | Xicor Inc | TT28HT010N-20EM vs X28C010PM-20 |
| 28C010TRT4DI-20 | EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 | Data Device Corporation | TT28HT010N-20EM vs 28C010TRT4DI-20 |