Part Details for WE128K32NP-250H1C by Microsemi Corporation
Overview of WE128K32NP-250H1C by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WE128K32NP-250H1C
WE128K32NP-250H1C CAD Models
WE128K32NP-250H1C Part Data Attributes
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WE128K32NP-250H1C
Microsemi Corporation
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Datasheet
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WE128K32NP-250H1C
Microsemi Corporation
EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | PGA | |
| Package Description | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | |
| Pin Count | 66 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.1.B.1 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 250 ns | |
| Additional Feature | USER CONFIGURABLE AS 512K X 8 | |
| Alternate Memory Width | 16 | |
| JESD-30 Code | S-CPGA-P66 | |
| JESD-609 Code | e4 | |
| Length | 27.3 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX32 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.34 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | GOLD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 27.3 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for WE128K32NP-250H1C
This table gives cross-reference parts and alternative options found for WE128K32NP-250H1C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WE128K32NP-250H1C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WE128K32N250H1I | 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WE128K32NP-250H1C vs WE128K32N250H1I |
| WE128K32P250H1IA | 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WE128K32NP-250H1C vs WE128K32P250H1IA |
| WE128K32NP-250H1QA | EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WE128K32NP-250H1C vs WE128K32NP-250H1QA |
| WE128K32P-250H1QA | EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WE128K32NP-250H1C vs WE128K32P-250H1QA |
| WE128K32NP-250H1I | EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WE128K32NP-250H1C vs WE128K32NP-250H1I |
| ACT-E128K32C-250P7Q | EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 | Cobham Power Products | WE128K32NP-250H1C vs ACT-E128K32C-250P7Q |
| WE128K32N250H1C | 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WE128K32NP-250H1C vs WE128K32N250H1C |
| WE128K32P250H1Q | 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WE128K32NP-250H1C vs WE128K32P250H1Q |
| WE128K32N-250H1MA | EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Mercury Systems Inc | WE128K32NP-250H1C vs WE128K32N-250H1MA |
| WE128K32N250H1CA | 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WE128K32NP-250H1C vs WE128K32N250H1CA |