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Memory / EEPROMs / WE128K32P250H1M
Datasheets
WE128K32P250H1M by:

128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Part Details for WE128K32P250H1M by Microsemi Corporation

Overview of WE128K32P250H1M by Microsemi Corporation

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Part Details for WE128K32P250H1M

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WE128K32P250H1M Part Data Attributes

Parametric Data
WE128K32P250H1M Microsemi Corporation
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WE128K32P250H1M Microsemi Corporation 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Part Package Code PGA
Package Description PGA,
Pin Count 66
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 250 ns
Additional Feature ALSO CONFIGURABLE AS 512K X 8
Alternate Memory Width 16
JESD-30 Code S-CPGA-P66
Length 27.3 mm
Memory Density 4194304 bit
Memory IC Type EEPROM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 66
Number of Words 131072 words
Number of Words Code 128000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Shape SQUARE
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 4.6 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 27.3 mm
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for WE128K32P250H1M

This table gives cross-reference parts and alternative options found for WE128K32P250H1M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WE128K32P250H1M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
WE128K32P-250H1Q Microsemi Corporation Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32P-250H1Q
WE128K32N250H1QA Microsemi Corporation Check for Price 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32N250H1QA
WE128K32NP-250H1IA Microsemi Corporation Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32NP-250H1IA
WE128K32N-250H1I Mercury Systems Inc Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32N-250H1I
WE128K32N-250H1M Mercury Systems Inc Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32N-250H1M
AS8E128K32P-250/883C Micross Components Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, PGA-66 WE128K32P250H1M vs AS8E128K32P-250/883C
WE128K32P250H1IA Microsemi Corporation Check for Price 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32P250H1IA
Part Number Manufacturer Composite Price Description Compare
WE128K32P-250H1I Microsemi Corporation Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32P-250H1I
WE128K32P250H1QA Microsemi Corporation Check for Price 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32P250H1QA
WE128K32N-250H1MA Mercury Systems Inc Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32N-250H1MA
WE128K32N-250H1Q Microsemi Corporation Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32N-250H1Q
WE128K32P250H1CA Microsemi Corporation Check for Price 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32P250H1CA
WE128K32NP-250H1I Microsemi Corporation Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32NP-250H1I
WE128K32P250H1MA Microsemi Corporation Check for Price 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32P250H1MA
WE128K32P250H1C Microsemi Corporation Check for Price 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32P250H1C
WE128K32P250H1Q Microsemi Corporation Check for Price 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 WE128K32P250H1M vs WE128K32P250H1Q
ACT-E128K32N-250P7Q Cobham Power Products Check for Price EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 WE128K32P250H1M vs ACT-E128K32N-250P7Q

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