Memory
WE128K32N250H1CA
Description: 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Overview of WE128K32N250H1CA by Microsemi Corporation

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Part Data Attributes for WE128K32N250H1CA by Microsemi Corporation

WE128K32N250H1CA
Microsemi Corporation
-
-
Part Life Cycle Code
Transferred
Ihs Manufacturer
MICROSEMI CORP
Part Package Code
PGA
Package Description
PGA,
Pin Count
66
Reach Compliance Code
unknown
ECCN Code
3A991.B.1.B.1
HTS Code
8542.32.00.51
Access Time-Max
250 ns
Additional Feature
ALSO CONFIGURABLE AS 512K X 8
Alternate Memory Width
16
JESD-30 Code
S-CPGA-P66
Length
27.3 mm
Memory Density
4194304 bit
Memory IC Type
EEPROM MODULE
Memory Width
32
Number of Functions
1
Number of Terminals
66
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Seated Height-Max
4.6 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
Width
27.3 mm
Write Cycle Time-Max (tWC)
10 ms
Want to compare parts?
  1. WE128K32N250H1CA
    Microsemi Corporation
    128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
    VS

Alternate Parts for WE128K32N250H1CA

This table gives cross-reference parts and alternative options found for WE128K32N250H1CA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WE128K32N250H1CA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
WE128K32N250H1I 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32N250H1I
WE128K32P250H1IA 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32P250H1IA
WE128K32NP-250H1QA EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32NP-250H1QA
WE128K32P-250H1QA EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32P-250H1QA
WE128K32NP-250H1I EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32NP-250H1I
ACT-E128K32C-250P7Q EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 Cobham Power Products WE128K32N250H1CA vs ACT-E128K32C-250P7Q
WE128K32N250H1C 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32N250H1C
WE128K32P250H1Q 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32P250H1Q
WE128K32N-250H1MA EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WE128K32N250H1CA vs WE128K32N-250H1MA
WE128K32NP-250H1IA EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32NP-250H1IA
Part Number Description Manufacturer Compare
WE128K32NP-250H1CA EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32NP-250H1CA
WE128K32N-250H1Q EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32N-250H1Q
WE128K32NP-250H1Q EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32NP-250H1Q
WE128K32P-250H1MA EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32P-250H1MA
ACT-E128K32C-250P7Q EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 Cobham Power Products WE128K32N250H1CA vs ACT-E128K32C-250P7Q
WE128K32P250H1M 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32P250H1M
WE128K32P250H1I 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32P250H1I
WE128K32P-250H1C EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32P-250H1C
WE128K32P-250H1QA EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32P-250H1QA
WE128K32P250H1MA 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WE128K32N250H1CA vs WE128K32P250H1MA

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