WE128K32NP-250H1C vs WE128K32NP-250H1Q feature comparison

WE128K32NP-250H1C Microsemi Corporation

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WE128K32NP-250H1Q Microsemi Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code PGA PGA
Package Description 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Pin Count 66 66
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.1.B.1 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 250 ns 250 ns
Additional Feature USER CONFIGURABLE AS 512K X 8 USER CONFIGURABLE AS 512K X 8
Alternate Memory Width 16 16
JESD-30 Code S-CPGA-P66 S-CPGA-P66
JESD-609 Code e4 e4
Length 27.3 mm 27.3 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type EEPROM MODULE EEPROM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX32 128KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.34 mm 4.34 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish GOLD GOLD
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 27.3 mm 27.3 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 2 2
Screening Level MIL-STD-883

Compare WE128K32NP-250H1C with alternatives

Compare WE128K32NP-250H1Q with alternatives