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Flash, 8MX1, PDIP8, 0.300 INCH, GREEN, PLASTIC, DIP-8
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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NAC | spiFlash, 8M-bit, 4Kb Uniform Sector, PDIP8(300mil) Package RoHS: Compliant Min Qty: 60 Package Multiple: 60 | 0 |
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$0.4000 / $0.4200 | Buy Now |
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W25Q80BVDAIG
Winbond Electronics Corp
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Datasheet
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Compare Parts:
W25Q80BVDAIG
Winbond Electronics Corp
Flash, 8MX1, PDIP8, 0.300 INCH, GREEN, PLASTIC, DIP-8
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Part Package Code | DIP | |
Package Description | 0.300 INCH, GREEN, PLASTIC, DIP-8 | |
Pin Count | 8 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Winbond | |
Clock Frequency-Max (fCLK) | 80 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PDIP-T8 | |
Length | 9.27 mm | |
Memory Density | 8388608 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | SERIAL | |
Programming Voltage | 3 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.33 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.000005 A | |
Supply Current-Max | 0.018 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Type | NOR TYPE | |
Width | 7.62 mm | |
Write Protection | HARDWARE/SOFTWARE |
This table gives cross-reference parts and alternative options found for W25Q80BVDAIG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q80BVDAIG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
W25Q80DVUXAE | Flash, 1MX8, PDSO8, USON-8 | Winbond Electronics Corp | W25Q80BVDAIG vs W25Q80DVUXAE |
AT45DB041B-CNL | Flash, 4MX1, 6 X 8 MM, 1 MM HEIGHT, 1.27 MM PITCH, CASON-8 | Atmel Corporation | W25Q80BVDAIG vs AT45DB041B-CNL |
S25FL004A0LNAI03 | Flash, 4MX1, PDSO8, 5 X 6 MM, PLASTIC, USON-8 | Spansion | W25Q80BVDAIG vs S25FL004A0LNAI03 |
M25PX32SOVMP3TB | Flash, 4MX8, PDSO8, 6 X 5 MM, ROHS COMPLIANT, VFQFP-8 | Micron Technology Inc | W25Q80BVDAIG vs M25PX32SOVMP3TB |
W25Q32BVZEIG | Flash, 32MX1, PDSO8, 8 X 6 MM, GREEN, WSON-8 | Winbond Electronics Corp | W25Q80BVDAIG vs W25Q32BVZEIG |
S25FL032P0XNFI010 | 4K X 16 FLASH 3V PROM, PDSO8, WSON-8 | Cypress Semiconductor | W25Q80BVDAIG vs S25FL032P0XNFI010 |
W25Q80BVSNIP | Flash, 8MX1, PDSO8, 0.150 INCH, GREEN, PLASTIC, SOIC-8 | Winbond Electronics Corp | W25Q80BVDAIG vs W25Q80BVSNIP |
M25PE40VMP6TP | EEPROM, 512KX8, Serial, CMOS, 6 X 5 MM, ROHS COMPLIANT, MLP-8 | Numonyx Memory Solutions | W25Q80BVDAIG vs M25PE40VMP6TP |
AT45DB021D-MH-SL954 | Flash, 2MX1, PDSO8, 6 X 5 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8 | Adesto Technologies Corporation | W25Q80BVDAIG vs AT45DB021D-MH-SL954 |
M25PE40-VMP6TP | Flash, 512KX8, PDSO8, 6 X 5 MM, ROHS COMPLIANT, VFQFP-8 | Micron Technology Inc | W25Q80BVDAIG vs M25PE40-VMP6TP |