Part Details for TSXC750AVGSU/T10LH by Thales Group
Overview of TSXC750AVGSU/T10LH by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSXC750AVGSU/T10LH
TSXC750AVGSU/T10LH CAD Models
TSXC750AVGSU/T10LH Part Data Attributes
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TSXC750AVGSU/T10LH
Thales Group
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Datasheet
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TSXC750AVGSU/T10LH
Thales Group
RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | CGA | |
| Package Description | , | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 83.3 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 233 MHz | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXC750AVGSU/T10LH
This table gives cross-reference parts and alternative options found for TSXC750AVGSU/T10LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXC750AVGSU/T10LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IBM25PPC750L-GB500A2R | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | TSXC750AVGSU/T10LH vs IBM25PPC750L-GB500A2R |
| MPC8541EPXAJEX | 32-BIT, 1420MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | TSXC750AVGSU/T10LH vs MPC8541EPXAJEX |
| XPC750PRX233LX | 32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | TSXC750AVGSU/T10LH vs XPC750PRX233LX |
| TSPC750AMGS10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSXC750AVGSU/T10LH vs TSPC750AMGS10LE |
| TSPC750AVGU/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSXC750AVGSU/T10LH vs TSPC750AVGU/T10LE |
| PPC7448HX1250NC | 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | TSXC750AVGSU/T10LH vs PPC7448HX1250NC |
| PCX7448VSH1267ND | RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 | Teledyne e2v | TSXC750AVGSU/T10LH vs PCX7448VSH1267ND |
| PC755BMGHU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | TSXC750AVGSU/T10LH vs PC755BMGHU350LE |
| PC7410MGHU450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | TSXC750AVGSU/T10LH vs PC7410MGHU450LE |
| PC755BMZFU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | TSXC750AVGSU/T10LH vs PC755BMZFU350LE |