Part Details for TC5316210CP by Toshiba America Electronic Components
Overview of TC5316210CP by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for TC5316210CP
TC5316210CP CAD Models
TC5316210CP Part Data Attributes
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TC5316210CP
Toshiba America Electronic Components
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Datasheet
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TC5316210CP
Toshiba America Electronic Components
IC 2M X 8 MASK PROM, 120 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | DIP | |
Package Description | 0.600 INCH, PLASTIC, DIP-42 | |
Pin Count | 42 | |
Reach Compliance Code | unknown | |
Access Time-Max | 120 ns | |
JESD-30 Code | R-PDIP-T42 | |
JESD-609 Code | e0 | |
Length | 53.2 mm | |
Memory Density | 16777216 bit | |
Memory IC Type | MASK ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 42 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 2MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 240 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.8 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15.24 mm |
Alternate Parts for TC5316210CP
This table gives cross-reference parts and alternative options found for TC5316210CP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC5316210CP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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UPD23C16040ACZ-XXX | MASK ROM, 2MX8, 120ns, MOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | NEC Electronics Group | TC5316210CP vs UPD23C16040ACZ-XXX |
LH5316P00CD | MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Sharp Corp | TC5316210CP vs LH5316P00CD |
LH53C16P00D | MASK ROM, 2MX8, 120ns, CMOS, PDIP42, DIP-42 | Sharp Corp | TC5316210CP vs LH53C16P00D |
MSM531602C-RS | 2MX8 MASK PROM, 120ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | OKI Electric Industry Co Ltd | TC5316210CP vs MSM531602C-RS |
GM23C16000B-12 | MASK ROM, 2MX8, 120ns, CMOS, PDIP42, | LG Semicon Co Ltd | TC5316210CP vs GM23C16000B-12 |
KM23C16000A-12 | MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Samsung Semiconductor | TC5316210CP vs KM23C16000A-12 |
LH53B16P00D | MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Sharp Corp | TC5316210CP vs LH53B16P00D |
LH53C16P00BD | MASK ROM, 2MX8, 120ns, CMOS, PDIP42, DIP-42 | Sharp Corp | TC5316210CP vs LH53C16P00BD |
HN624316PN-12 | MASK ROM, 2MX8, 120ns, CMOS, PDIP42, PLASTIC, DIP-42 | Hitachi Ltd | TC5316210CP vs HN624316PN-12 |
HN624416NP-12 | MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Hitachi Ltd | TC5316210CP vs HN624416NP-12 |