Datasheets
TC5316210CP by: Toshiba America Electronic Components

IC 2M X 8 MASK PROM, 120 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM

Part Details for TC5316210CP by Toshiba America Electronic Components

Overview of TC5316210CP by Toshiba America Electronic Components

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Part Details for TC5316210CP

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TC5316210CP Part Data Attributes

TC5316210CP Toshiba America Electronic Components
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TC5316210CP Toshiba America Electronic Components IC 2M X 8 MASK PROM, 120 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code DIP
Package Description 0.600 INCH, PLASTIC, DIP-42
Pin Count 42
Reach Compliance Code unknown
Access Time-Max 120 ns
JESD-30 Code R-PDIP-T42
JESD-609 Code e0
Length 53.2 mm
Memory Density 16777216 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 42
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
Seated Height-Max 4.8 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for TC5316210CP

This table gives cross-reference parts and alternative options found for TC5316210CP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC5316210CP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
UPD23C16040ACZ-XXX MASK ROM, 2MX8, 120ns, MOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 NEC Electronics Group TC5316210CP vs UPD23C16040ACZ-XXX
LH5316P00CD MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Sharp Corp TC5316210CP vs LH5316P00CD
LH53C16P00D MASK ROM, 2MX8, 120ns, CMOS, PDIP42, DIP-42 Sharp Corp TC5316210CP vs LH53C16P00D
MSM531602C-RS 2MX8 MASK PROM, 120ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42 OKI Electric Industry Co Ltd TC5316210CP vs MSM531602C-RS
GM23C16000B-12 MASK ROM, 2MX8, 120ns, CMOS, PDIP42, LG Semicon Co Ltd TC5316210CP vs GM23C16000B-12
KM23C16000A-12 MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Samsung Semiconductor TC5316210CP vs KM23C16000A-12
LH53B16P00D MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Sharp Corp TC5316210CP vs LH53B16P00D
LH53C16P00BD MASK ROM, 2MX8, 120ns, CMOS, PDIP42, DIP-42 Sharp Corp TC5316210CP vs LH53C16P00BD
HN624316PN-12 MASK ROM, 2MX8, 120ns, CMOS, PDIP42, PLASTIC, DIP-42 Hitachi Ltd TC5316210CP vs HN624316PN-12
HN624416NP-12 MASK ROM, 2MX8, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Hitachi Ltd TC5316210CP vs HN624416NP-12
Part Number Description Manufacturer Compare
HN624116P-25L MASK ROM, 2MX8, 250ns, CMOS, PDIP42, PLASTIC, DIP-42 Hitachi Ltd TC5316210CP vs HN624116P-25L
M27C160-70B1 1MX16 OTPROM, 70ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42 STMicroelectronics TC5316210CP vs M27C160-70B1
MR53V1602J-XXRA MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 LAPIS Semiconductor Co Ltd TC5316210CP vs MR53V1602J-XXRA
K3N5U1000D-DC10 MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor TC5316210CP vs K3N5U1000D-DC10
M27V160-120XF6 1MX16 UVPROM, 120ns, CDIP42, ROHS COMPLIANT, CERAMIC, FDIP-42 STMicroelectronics TC5316210CP vs M27V160-120XF6
K3N5C1000D-DC12 MASK ROM, 1MX16, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor TC5316210CP vs K3N5C1000D-DC12
GM23C16000A-12 MASK ROM, 2MX8, 120ns, CMOS, PDIP42, Goldstar Electron Co Ltd TC5316210CP vs GM23C16000A-12
M27C160-200F1 2MX8 UVPROM, 200ns, CDIP42, WINDOWED, FRIT SEALED, CERAMIC, DIP-42 STMicroelectronics TC5316210CP vs M27C160-200F1
MR27V1652D-XXRA MASK ROM, 1MX16, 80ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 LAPIS Semiconductor Co Ltd TC5316210CP vs MR27V1652D-XXRA
HN624316PN-15 2MX8 MASK PROM, 150ns, PDIP42, PLASTIC, DIP-42 Renesas Electronics Corporation TC5316210CP vs HN624316PN-15

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