Part Details for M27C160-200F1 by STMicroelectronics
Overview of M27C160-200F1 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for M27C160-200F1
M27C160-200F1 CAD Models
M27C160-200F1 Part Data Attributes
|
M27C160-200F1
STMicroelectronics
Buy Now
Datasheet
|
Compare Parts:
M27C160-200F1
STMicroelectronics
2MX8 UVPROM, 200ns, CDIP42, WINDOWED, FRIT SEALED, CERAMIC, DIP-42
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | DIP | |
Package Description | WINDOWED, FRIT SEALED, CERAMIC, DIP-42 | |
Pin Count | 42 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
Alternate Memory Width | 8 | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T42 | |
JESD-609 Code | e0 | |
Memory Density | 16777216 bit | |
Memory IC Type | UVPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 42 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP42,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.71 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for M27C160-200F1
This table gives cross-reference parts and alternative options found for M27C160-200F1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C160-200F1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MSM27C1652CZ-XXRS | OTP ROM, 2MX8, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | OKI Electric Industry Co Ltd | M27C160-200F1 vs MSM27C1652CZ-XXRS |
GM23C16050-15 | MASK ROM, 2MX8, 150ns, CMOS, PDIP42, | Goldstar Electron Co Ltd | M27C160-200F1 vs GM23C16050-15 |
TC5716200D-200 | IC 2M X 8 UVPROM, 200 ns, CDIP42, 0.600 INCH, WINDOWED, CERDIP-42, Programmable ROM | Toshiba America Electronic Components | M27C160-200F1 vs TC5716200D-200 |
GM23C16000A-12 | MASK ROM, 2MX8, 120ns, CMOS, PDIP42, | Goldstar Electron Co Ltd | M27C160-200F1 vs GM23C16000A-12 |
TC5316200AP | IC 2M X 8 MASK PROM, 150 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM | Toshiba America Electronic Components | M27C160-200F1 vs TC5316200AP |
KM23V16000A-35 | MASK ROM, 2MX8, 350ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Samsung Semiconductor | M27C160-200F1 vs KM23V16000A-35 |
LH5316500CD-15 | MASK ROM, 2MX8, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Sharp Corp | M27C160-200F1 vs LH5316500CD-15 |
KM23C16005A-20 | MASK ROM, 2MX8, 200ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Samsung Semiconductor | M27C160-200F1 vs KM23C16005A-20 |
KM23V16000A-30 | MASK ROM, 2MX8, 300ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Samsung Semiconductor | M27C160-200F1 vs KM23V16000A-30 |
TC5316200BP | IC 2M X 8 MASK PROM, 200 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM | Toshiba America Electronic Components | M27C160-200F1 vs TC5316200BP |