Datasheets
S634000M-P by: Gould Ami

MASK ROM, 512KX8, 250ns, CMOS, PDIP40,

Part Details for S634000M-P by Gould Ami

Overview of S634000M-P by Gould Ami

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for S634000M-P

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S634000M-P Part Data Attributes

S634000M-P Gould Ami
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S634000M-P Gould Ami MASK ROM, 512KX8, 250ns, CMOS, PDIP40,
Part Life Cycle Code Obsolete
Ihs Manufacturer GOULD AMI
Package Description ,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 60 ns
JESD-30 Code R-PDIP-T40
Memory Density 65536 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 40
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for S634000M-P

This table gives cross-reference parts and alternative options found for S634000M-P. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S634000M-P, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
UPD23C4000C MASK ROM, 512KX8, 250ns, CMOS, PDIP40, PLASTIC, DIP-40 NEC Electronics America Inc S634000M-P vs UPD23C4000C
KM23C4100A-25 MASK ROM, 512KX8, 250ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Samsung Semiconductor S634000M-P vs KM23C4100A-25
MN234001 MASK ROM, 512KX8, 250ns, NMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Panasonic Electronic Components S634000M-P vs MN234001
Part Number Description Manufacturer Compare
KM23C4200B-20 MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Samsung Semiconductor S634000M-P vs KM23C4200B-20
MX23C4096PC-15 MASK ROM, 256KX16, 150ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Macronix International Co Ltd S634000M-P vs MX23C4096PC-15
KM23C4100-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Samsung Semiconductor S634000M-P vs KM23C4100-15
LH534P00BD MASK ROM, 512KX8, 120ns, CMOS, PDIP40, DIP-40 Sharp Corp S634000M-P vs LH534P00BD
MR27V402E-XXXRP MASK ROM, 256KX16, 70ns, CMOS, PDIP40, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-40 LAPIS Semiconductor Co Ltd S634000M-P vs MR27V402E-XXXRP
KM23C4200A-12 MASK ROM, 512KX8, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Samsung Semiconductor S634000M-P vs KM23C4200A-12
KM23V4100D-12 MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, DIP-40 Samsung Semiconductor S634000M-P vs KM23V4100D-12
UPD23C4000C MASK ROM, 512KX8, 250ns, CMOS, PDIP40, PLASTIC, DIP-40 NEC Electronics America Inc S634000M-P vs UPD23C4000C
MR27V402ERP MASK ROM, 256KX16, 80ns, CMOS, PDIP40, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-40 LAPIS Semiconductor Co Ltd S634000M-P vs MR27V402ERP
MSM534000CRS MASK ROM, 256KX16, 120ns, CMOS, PDIP40, PLASTIC, DIP-40 OKI Electric Industry Co Ltd S634000M-P vs MSM534000CRS

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