S634000M-P vs KM23C4200A-12 feature comparison

S634000M-P Gould Ami

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KM23C4200A-12 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOULD AMI SAMSUNG SEMICONDUCTOR INC
Package Description , DIP, DIP40,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 60 ns 120 ns
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Memory Density 65536 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX8 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.08 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 40
Alternate Memory Width 16
JESD-609 Code e0
Length 52.43 mm
Output Characteristics 3-STATE
Package Code DIP
Package Equivalence Code DIP40,.6
Seated Height-Max 5.08 mm
Standby Current-Max 0.00005 A
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

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Compare KM23C4200A-12 with alternatives