Part Details for PCX755VGU400LE by Teledyne e2v
Overview of PCX755VGU400LE by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PCX755VGU400LE
PCX755VGU400LE CAD Models
PCX755VGU400LE Part Data Attributes
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PCX755VGU400LE
Teledyne e2v
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Datasheet
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PCX755VGU400LE
Teledyne e2v
RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360
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Part Life Cycle Code | Active | |
Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 360 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B360 | |
Length | 25 mm | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 110 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.2 mm | |
Speed | 400 MHz | |
Supply Voltage-Max | 2.1 V | |
Supply Voltage-Min | 1.9 V | |
Supply Voltage-Nom | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PCX755VGU400LE
This table gives cross-reference parts and alternative options found for PCX755VGU400LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX755VGU400LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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PC755VGHU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Teledyne e2v | PCX755VGU400LE vs PC755VGHU400LE |
XPC755BPX400LER2 | 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 | Motorola Mobility LLC | PCX755VGU400LE vs XPC755BPX400LER2 |
MPC755CPX400 | 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 | Freescale Semiconductor | PCX755VGU400LE vs MPC755CPX400 |
PC755BVZFU400LD | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Teledyne e2v | PCX755VGU400LE vs PC755BVZFU400LD |
PC755MG400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | PCX755VGU400LE vs PC755MG400LE |
XPC755BRX400TE | 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 | Freescale Semiconductor | PCX755VGU400LE vs XPC755BRX400TE |
PC755VG400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | PCX755VGU400LE vs PC755VG400LE |
PCX755BMZFU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Atmel Corporation | PCX755VGU400LE vs PCX755BMZFU400LE |
MPC755CPX400LE | 360PBGA, RV2.8, 4A, 105C. HIP4 | Freescale Semiconductor | PCX755VGU400LE vs MPC755CPX400LE |
PC755BVGU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Atmel Corporation | PCX755VGU400LE vs PC755BVGU400LE |