Datasheets
PC7410MGU400NE by:

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

Part Details for PC7410MGU400NE by Atmel Corporation

Overview of PC7410MGU400NE by Atmel Corporation

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Part Details for PC7410MGU400NE

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PC7410MGU400NE Part Data Attributes

PC7410MGU400NE Atmel Corporation
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PC7410MGU400NE Atmel Corporation RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer ATMEL CORP
Part Package Code BGA
Package Description BGA, BGA360,19X19,50
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 133 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.2 mm
Speed 400 MHz
Supply Voltage-Max 1.55 V
Supply Voltage-Min 1.45 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC7410MGU400NE

This table gives cross-reference parts and alternative options found for PC7410MGU400NE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC7410MGU400NE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC7410VGSU400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410MGU400NE vs PC7410VGSU400NE
PC7410MGSU400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410MGU400NE vs PC7410MGSU400NE
PC7410MGU400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v PC7410MGU400NE vs PC7410MGU400NE
PC7410MGHU400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC7410MGU400NE vs PC7410MGHU400NE
PC7410MGHU400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation PC7410MGU400NE vs PC7410MGHU400NE
PC7410VGU400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC7410MGU400NE vs PC7410VGU400NE
PC7410VGS400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PC7410MGU400NE vs PC7410VGS400NE
PC7410VGSU400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PC7410MGU400NE vs PC7410VGSU400NE
PC7410MGS400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410MGU400NE vs PC7410MGS400NE
PCX7410MGSU400NE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PC7410MGU400NE vs PCX7410MGSU400NE
Part Number Description Manufacturer Compare
FWPXA270C0E416 Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360 Marvell Technology Group Ltd PC7410MGU400NE vs FWPXA270C0E416
PC755MZF366LE RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Atmel Corporation PC7410MGU400NE vs PC755MZF366LE
TSXPC750AMGSU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC7410MGU400NE vs TSXPC750AMGSU/T10LH
PC7448FGH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v PC7410MGU400NE vs PC7448FGH1267ND
MPC755BPX350TD 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 Motorola Mobility LLC PC7410MGU400NE vs MPC755BPX350TD
PC7447MGHU1300NC RISC Microprocessor, 32-Bit, 1300MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Atmel Corporation PC7410MGU400NE vs PC7447MGHU1300NC
TSPC750AVG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC7410MGU400NE vs TSPC750AVG10LE
PC7447AVGH1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC7410MGU400NE vs PC7447AVGH1000NC
MPC8541VTALFX 32-BIT, 1420MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 Freescale Semiconductor PC7410MGU400NE vs MPC8541VTALFX
PPC7448VU1000LD 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 Freescale Semiconductor PC7410MGU400NE vs PPC7448VU1000LD

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