Datasheets
CY27C256-200WC by:

UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28

Part Details for CY27C256-200WC by Rochester Electronics LLC

Overview of CY27C256-200WC by Rochester Electronics LLC

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

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Part Details for CY27C256-200WC

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CY27C256-200WC Part Data Attributes

CY27C256-200WC Rochester Electronics LLC
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CY27C256-200WC Rochester Electronics LLC UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description 0.600 INCH, WINDOWED, CERDIP-28
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for CY27C256-200WC

This table gives cross-reference parts and alternative options found for CY27C256-200WC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY27C256-200WC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8606311UA UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor CY27C256-200WC vs 5962-8606311UA
5962-8606311UX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v CY27C256-200WC vs 5962-8606311UX
NM27LC256Q200 IC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation CY27C256-200WC vs NM27LC256Q200
NM27C256NE200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation CY27C256-200WC vs NM27C256NE200
CY27C256-200WC UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Cypress Semiconductor CY27C256-200WC vs CY27C256-200WC
NMC27C256BN200 32KX8 OTPROM, 200ns, PDIP28, PLASTIC, DIP-28 Texas Instruments CY27C256-200WC vs NMC27C256BN200
27C256MQB/C20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v CY27C256-200WC vs 27C256MQB/C20
TMX27PC256-2NL 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments CY27C256-200WC vs TMX27PC256-2NL
27C256MQB/C20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Thales Group CY27C256-200WC vs 27C256MQB/C20
AM27C256-200PI OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28 Spansion CY27C256-200WC vs AM27C256-200PI
Part Number Description Manufacturer Compare
FT27C256R-20LM UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd CY27C256-200WC vs FT27C256R-20LM
FT27C256R-20LMB UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Force Technologies Ltd CY27C256-200WC vs FT27C256R-20LMB
UPD27C256AD-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 NEC Electronics Group CY27C256-200WC vs UPD27C256AD-20
QP27C256L-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v CY27C256-200WC vs QP27C256L-200/XA
QD27C256-200V10 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Intel Corporation CY27C256-200WC vs QD27C256-200V10
CY27C256A-200WI UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor CY27C256-200WC vs CY27C256A-200WI
NM27C256N200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation CY27C256-200WC vs NM27C256N200
WS27C256L-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Waferscale Integration Inc CY27C256-200WC vs WS27C256L-20DMB
AM27C256-205DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD CY27C256-200WC vs AM27C256-205DCB
AM27C256-200/BXA UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD CY27C256-200WC vs AM27C256-200/BXA

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