Part Details for CY27C256-200WC by Rochester Electronics LLC
Overview of CY27C256-200WC by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for CY27C256-200WC
CY27C256-200WC CAD Models
CY27C256-200WC Part Data Attributes
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CY27C256-200WC
Rochester Electronics LLC
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Datasheet
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CY27C256-200WC
Rochester Electronics LLC
UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | DIP | |
Package Description | 0.600 INCH, WINDOWED, CERDIP-28 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32KX8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Current-Max | 0.045 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | DUAL |
Alternate Parts for CY27C256-200WC
This table gives cross-reference parts and alternative options found for CY27C256-200WC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY27C256-200WC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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DQ27C256-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | CY27C256-200WC vs DQ27C256-20 |
8411103YX | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | AMD | CY27C256-200WC vs 8411103YX |
QP27C256-200/QYA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | CY27C256-200WC vs QP27C256-200/QYA |
M38510/22402BYX | UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28 | AMD | CY27C256-200WC vs M38510/22402BYX |
DM27C256-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | CY27C256-200WC vs DM27C256-20 |
TMS27PC256-2NL | 262 144-Bitprogrammable Read-Only Memory 28-PDIP 0 to 70 | Texas Instruments | CY27C256-200WC vs TMS27PC256-2NL |
5962-3822402BYX | UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28 | Intel Corporation | CY27C256-200WC vs 5962-3822402BYX |
NM27LC256NE200 | 32KX8 OTPROM, 200ns, PDIP28, PLASTIC, DIP-28 | Texas Instruments | CY27C256-200WC vs NM27LC256NE200 |
5962-8606301UX | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | CY27C256-200WC vs 5962-8606301UX |
NMC27C256BN200 | IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | National Semiconductor Corporation | CY27C256-200WC vs NMC27C256BN200 |