Datasheets
MPC755BPX400TD by:

32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360

Part Details for MPC755BPX400TD by Motorola Mobility LLC

Overview of MPC755BPX400TD by Motorola Mobility LLC

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Applications Industrial Automation Healthcare Renewable Energy Robotics and Drones

Part Details for MPC755BPX400TD

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MPC755BPX400TD Part Data Attributes

MPC755BPX400TD Motorola Mobility LLC
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MPC755BPX400TD Motorola Mobility LLC 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan NO
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B360
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Speed 400 MHz
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MPC755BPX400TD

This table gives cross-reference parts and alternative options found for MPC755BPX400TD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC755BPX400TD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IBM25PPC750L-GB500A2R RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM MPC755BPX400TD vs IBM25PPC750L-GB500A2R
MPC8541EPXAJEX 32-BIT, 1420MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 Freescale Semiconductor MPC755BPX400TD vs MPC8541EPXAJEX
XPC750PRX233LX 32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor MPC755BPX400TD vs XPC750PRX233LX
TSPC750AMGS10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 Thales Group MPC755BPX400TD vs TSPC750AMGS10LE
TSPC750AVGU/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group MPC755BPX400TD vs TSPC750AVGU/T10LE
PPC7448HX1250NC 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor MPC755BPX400TD vs PPC7448HX1250NC
PCX7448VSH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 Teledyne e2v MPC755BPX400TD vs PCX7448VSH1267ND
PC755BMGHU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation MPC755BPX400TD vs PC755BMGHU350LE
PC7410MGHU450LE RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation MPC755BPX400TD vs PC7410MGHU450LE
PC755BMZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 Thales Group MPC755BPX400TD vs PC755BMZFU350LE

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