Part Details for MPC755BPX400TD by Motorola Mobility LLC
Overview of MPC755BPX400TD by Motorola Mobility LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Part Details for MPC755BPX400TD
MPC755BPX400TD CAD Models
MPC755BPX400TD Part Data Attributes
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MPC755BPX400TD
Motorola Mobility LLC
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Datasheet
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MPC755BPX400TD
Motorola Mobility LLC
32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MOTOROLA INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 360 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | NO | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B360 | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Speed | 400 MHz | |
Supply Voltage-Nom | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC755BPX400TD
This table gives cross-reference parts and alternative options found for MPC755BPX400TD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC755BPX400TD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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IBM25PPC750L-GB500A2R | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | MPC755BPX400TD vs IBM25PPC750L-GB500A2R |
MPC8541EPXAJEX | 32-BIT, 1420MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | MPC755BPX400TD vs MPC8541EPXAJEX |
XPC750PRX233LX | 32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | MPC755BPX400TD vs XPC750PRX233LX |
TSPC750AMGS10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 | Thales Group | MPC755BPX400TD vs TSPC750AMGS10LE |
TSPC750AVGU/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | MPC755BPX400TD vs TSPC750AVGU/T10LE |
PPC7448HX1250NC | 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | MPC755BPX400TD vs PPC7448HX1250NC |
PCX7448VSH1267ND | RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 | Teledyne e2v | MPC755BPX400TD vs PCX7448VSH1267ND |
PC755BMGHU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | MPC755BPX400TD vs PC755BMGHU350LE |
PC7410MGHU450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | MPC755BPX400TD vs PC7410MGHU450LE |
PC755BMZFU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | MPC755BPX400TD vs PC755BMZFU350LE |