Datasheets
MPC7410RX500LC by:

IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC

Part Details for MPC7410RX500LC by Freescale Semiconductor

Overview of MPC7410RX500LC by Freescale Semiconductor

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Part Details for MPC7410RX500LC

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MPC7410RX500LC Part Data Attributes

MPC7410RX500LC Freescale Semiconductor
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MPC7410RX500LC Freescale Semiconductor IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC
Part Life Cycle Code Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 133 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code HBGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Qualification Status Not Qualified
Seated Height-Max 3.2 mm
Speed 500 MHz
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MPC7410RX500LC

This table gives cross-reference parts and alternative options found for MPC7410RX500LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC7410RX500LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC7410VGHU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v MPC7410RX500LC vs PC7410VGHU500LE
PCX7410VGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation MPC7410RX500LC vs PCX7410VGSU500LE
PC7410MGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation MPC7410RX500LC vs PC7410MGSU500LE
MPC7410VS500LE 32-BIT, 500MHz, RISC PROCESSOR, CLGA360 NXP Semiconductors MPC7410RX500LC vs MPC7410VS500LE
MPC7410RX500LD RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Semiconductor Products MPC7410RX500LC vs MPC7410RX500LD
PC7410VGU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v MPC7410RX500LC vs PC7410VGU500LE
PC7410VGHU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation MPC7410RX500LC vs PC7410VGHU500LE
MPC7410RX500LC 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC MPC7410RX500LC vs MPC7410RX500LC
MPC7410RX500LX 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC MPC7410RX500LC vs MPC7410RX500LX
MPC7410HX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors MPC7410RX500LC vs MPC7410HX500LE
Part Number Description Manufacturer Compare
MPC7410RX500LX 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC MPC7410RX500LC vs MPC7410RX500LX
PC7410MGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v MPC7410RX500LC vs PC7410MGSU500LE
PC7410MGH500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v MPC7410RX500LC vs PC7410MGH500NE
PC7410VGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v MPC7410RX500LC vs PC7410VGSU500LE
MPC7410HX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors MPC7410RX500LC vs MPC7410HX500LE
PC7410MG500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v MPC7410RX500LC vs PC7410MG500NE
PCX7410MGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v MPC7410RX500LC vs PCX7410MGSU500LE
PC7410VG500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v MPC7410RX500LC vs PC7410VG500NE
MPC7410RX500LX RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Semiconductor Products MPC7410RX500LC vs MPC7410RX500LX
PCX7410VGSU500NE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360 Microchip Technology Inc MPC7410RX500LC vs PCX7410VGSU500NE

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