MPC7410RX500LC
vs
PCX7410VGSU500NE
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
|
COLUMN INTERPOSER, CERAMIC, CGA-360
|
Pin Count |
360
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
133 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B360
|
S-CBGA-C360
|
Length |
25 mm
|
25 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
360
|
360
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
HBGA
|
CGA
|
Package Equivalence Code |
BGA360,19X19,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.2 mm
|
4.2 mm
|
Speed |
500 MHz
|
500 MHz
|
Supply Voltage-Max |
1.9 V
|
1.55 V
|
Supply Voltage-Min |
1.7 V
|
1.45 V
|
Supply Voltage-Nom |
1.8 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
C BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
25 mm
|
25 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
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