Datasheets
PC7410MGSU500LE by:

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

Part Details for PC7410MGSU500LE by Atmel Corporation

Overview of PC7410MGSU500LE by Atmel Corporation

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Part Details for PC7410MGSU500LE

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PC7410MGSU500LE Part Data Attributes

PC7410MGSU500LE Atmel Corporation
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PC7410MGSU500LE Atmel Corporation RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer ATMEL CORP
Part Package Code BGA
Package Description BGA, BGA360,19X19,50
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 133 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.2 mm
Speed 500 MHz
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC7410MGSU500LE

This table gives cross-reference parts and alternative options found for PC7410MGSU500LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC7410MGSU500LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MPC7410VS500LE NITRO R1.4,105C,PB FREE Freescale Semiconductor PC7410MGSU500LE vs MPC7410VS500LE
PC7410VGHU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v PC7410MGSU500LE vs PC7410VGHU500LE
PCX7410VGHU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Atmel Corporation PC7410MGSU500LE vs PCX7410VGHU500LE
MPC7410RX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC7410MGSU500LE vs MPC7410RX500LE
MPC7410THX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 Motorola Mobility LLC PC7410MGSU500LE vs MPC7410THX500LE
MPC7410TRX500LE 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC7410MGSU500LE vs MPC7410TRX500LE
MPC7410RX500LC RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Semiconductor Products PC7410MGSU500LE vs MPC7410RX500LC
PCX7410MGSU500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 Teledyne e2v PC7410MGSU500LE vs PCX7410MGSU500LE
PC7410MGS500LE RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation PC7410MGSU500LE vs PC7410MGS500LE
MPC7410RX500LD 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor PC7410MGSU500LE vs MPC7410RX500LD
Part Number Description Manufacturer Compare
TSXC750AMGU/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC7410MGSU500LE vs TSXC750AMGU/T8LH
MPC8541ECPXAPEX 32-BIT, 1600MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 Freescale Semiconductor PC7410MGSU500LE vs MPC8541ECPXAPEX
PCX7447AVGH1000NB RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v PC7410MGSU500LE vs PCX7447AVGH1000NB
NHPXA270C0E416 RISC Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360 Intel Corporation PC7410MGSU500LE vs NHPXA270C0E416
TSPC750AVGU/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC7410MGSU500LE vs TSPC750AVGU/T8LE
PC7447AVGHY1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 Atmel Corporation PC7410MGSU500LE vs PC7447AVGHY1000NC
XPC755BRX300LE 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 Motorola Mobility LLC PC7410MGSU500LE vs XPC755BRX300LE
PC755BVGU366LE RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, CERAMIC, BGA-360 Atmel Corporation PC7410MGSU500LE vs PC755BVGU366LE
TSPC750AMGU/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC7410MGSU500LE vs TSPC750AMGU/T8LH
PCX7447VGU600LB RISC Microprocessor, 32-Bit, 600MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC7410MGSU500LE vs PCX7447VGU600LB

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