Part Details for MH2M325CXJ-6 by Mitsubishi Electric
Overview of MH2M325CXJ-6 by Mitsubishi Electric
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Part Details for MH2M325CXJ-6
MH2M325CXJ-6 CAD Models
MH2M325CXJ-6 Part Data Attributes
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MH2M325CXJ-6
Mitsubishi Electric
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Datasheet
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MH2M325CXJ-6
Mitsubishi Electric
EDO DRAM Module, 2MX32, 60ns, CMOS, SIMM-72
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MITSUBISHI ELECTRIC CORP | |
| Part Package Code | SIMM | |
| Package Description | SIMM, SSIM72 | |
| Pin Count | 72 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Access Mode | FAST PAGE WITH EDO | |
| Access Time-Max | 60 ns | |
| Additional Feature | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | |
| Alternate Memory Width | 16 | |
| I/O Type | COMMON | |
| JESD-30 Code | R-XSMA-N72 | |
| Memory Density | 67108864 bit | |
| Memory IC Type | EDO DRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 72 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | UNSPECIFIED | |
| Package Code | SIMM | |
| Package Equivalence Code | SSIM72 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 1024 | |
| Seated Height-Max | 20.32 mm | |
| Self Refresh | NO | |
| Standby Current-Max | 0.004 A | |
| Supply Current-Max | 0.6 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | SINGLE |
Alternate Parts for MH2M325CXJ-6
This table gives cross-reference parts and alternative options found for MH2M325CXJ-6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MH2M325CXJ-6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MB322BT08TASN60 | 2MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72 | Motorola Mobility LLC | MH2M325CXJ-6 vs MB322BT08TASN60 |
| TM248GBK32H-60 | 2MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72 | Texas Instruments | MH2M325CXJ-6 vs TM248GBK32H-60 |
| ESA2UN3211B-60JG-S | MEMORY MODULE,DRAM,EDO,2MX32,CMOS,SSIM,72PIN,PLASTIC | FUJITSU Semiconductor Limited | MH2M325CXJ-6 vs ESA2UN3211B-60JG-S |
| HB56H232SB-6BN | EDO DRAM Module, 2MX32, 60ns, MOS, SIMM-72 | Hitachi Ltd | MH2M325CXJ-6 vs HB56H232SB-6BN |
| MB322BJ08TASG60 | 2MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72 | Motorola Mobility LLC | MH2M325CXJ-6 vs MB322BJ08TASG60 |
| HYM532224ATE-60 | EDO DRAM Module, 2MX32, 60ns, CMOS, SIMM-72 | SK Hynix Inc | MH2M325CXJ-6 vs HYM532224ATE-60 |
| MB322BJ08TASN60 | EDO DRAM Module, 2MX32, 60ns, MOS, SIMM-72 | Motorola Semiconductor Products | MH2M325CXJ-6 vs MB322BJ08TASN60 |
| MB322CT08TASN60 | 2MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72 | Motorola Mobility LLC | MH2M325CXJ-6 vs MB322CT08TASN60 |
| MB322BT08TASG60 | 2MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72 | Motorola Mobility LLC | MH2M325CXJ-6 vs MB322BT08TASG60 |
| MB322BJ08TASN60 | 2MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72 | Motorola Mobility LLC | MH2M325CXJ-6 vs MB322BJ08TASN60 |