Part Details for MBM10470A-10CZ by FUJITSU Semiconductor Limited
Overview of MBM10470A-10CZ by FUJITSU Semiconductor Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for MBM10470A-10CZ
MBM10470A-10CZ CAD Models
MBM10470A-10CZ Part Data Attributes:
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MBM10470A-10CZ
FUJITSU Semiconductor Limited
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Datasheet
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MBM10470A-10CZ
FUJITSU Semiconductor Limited
Standard SRAM, 4KX1, 10ns, TTL, CDIP18, CERDIP-18
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
| Package Description | DIP, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 10 ns | |
| JESD-30 Code | R-GDIP-T18 | |
| Length | 22.78 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 18 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX1 | |
| Output Characteristics | OPEN-EMITTER | |
| Output Enable | NO | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Surface Mount | NO | |
| Technology | TTL | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for MBM10470A-10CZ
This table gives cross-reference parts and alternative options found for MBM10470A-10CZ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBM10470A-10CZ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT6167LA25SO8 | Standard SRAM, 16KX1, 25ns, CMOS, PDSO20, 0.300 INCH, SOIC-20 | Integrated Device Technology Inc | MBM10470A-10CZ vs IDT6167LA25SO8 |
| MBM10470A-15CZ | 4KX1 STANDARD SRAM, 15ns, CDIP18, CERDIP-18 | FUJITSU Limited | MBM10470A-10CZ vs MBM10470A-15CZ |
| IDT6167SA45DB | Standard SRAM, 16KX1, 45ns, CMOS, CDIP20, 0.300 INCH, CERDIP-20 | Integrated Device Technology Inc | MBM10470A-10CZ vs IDT6167SA45DB |
| AM2167-45DC | Standard SRAM, 16KX1, 40ns, NMOS, CDIP20, CERAMIC, DIP-20 | AMD | MBM10470A-10CZ vs AM2167-45DC |
| MAR5114CB | Standard SRAM, 1KX4, 135ns, CMOS, CDIP18, | Plessey Semiconductors Ltd | MBM10470A-10CZ vs MAR5114CB |
| L7C167UC8 | Standard SRAM, 16KX1, 8ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOIC-20 | LOGIC Devices Inc | MBM10470A-10CZ vs L7C167UC8 |
| 6167LA45LB | LCC-20, Tube | Integrated Device Technology Inc | MBM10470A-10CZ vs 6167LA45LB |
| HM4-6504S-9 | Standard SRAM, 4KX1, 120ns, CMOS, CQCC18 | Harris Semiconductor | MBM10470A-10CZ vs HM4-6504S-9 |
| NMC2147HJ-2 | 4KX1 STANDARD SRAM, 45ns, CDIP18, CERAMIC, DIP-18 | Texas Instruments | MBM10470A-10CZ vs NMC2147HJ-2 |
| IDT6167SA45EB | Standard SRAM, 16KX1, 45ns, CMOS, CDFP20, 0.300 INCH, CERPACK-20 | Integrated Device Technology Inc | MBM10470A-10CZ vs IDT6167SA45EB |