MBM10470A-10CZ vs 6167LA45LB feature comparison

MBM10470A-10CZ FUJITSU Semiconductor Limited

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6167LA45LB Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description DIP, 0.300 INCH, LCC-20
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 45 ns
JESD-30 Code R-GDIP-T18 R-XQCC-N20
Length 22.78 mm
Memory Density 4096 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1
Number of Terminals 18 20
Number of Words 4096 words 16384 words
Number of Words Code 4000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 4KX1 16KX1
Output Characteristics OPEN-EMITTER 3-STATE
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Part Package Code LCC
Pin Count 20
Manufacturer Package Code LZ20
I/O Type SEPARATE
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code LCC20,.3X.43
Peak Reflow Temperature (Cel) 260
Screening Level MIL-STD-883 Class B
Standby Current-Max 0.0002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.065 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Terminal Finish TIN LEAD

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Compare 6167LA45LB with alternatives