Datasheets
MB7137HCF by:

IC,PROM,2KX8,TTL,FP,24PIN,CERAMIC

Part Details for MB7137HCF by FUJITSU Semiconductor Limited

Overview of MB7137HCF by FUJITSU Semiconductor Limited

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Applications Education and Research Environmental Monitoring Smart Cities Aerospace and Defense Agriculture Technology Automotive Robotics and Drones

Part Details for MB7137HCF

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MB7137HCF Part Data Attributes

MB7137HCF FUJITSU Semiconductor Limited
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MB7137HCF FUJITSU Semiconductor Limited IC,PROM,2KX8,TTL,FP,24PIN,CERAMIC
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer FUJITSU LTD
Package Description DFP, FL24,.4
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 70 ns
JESD-30 Code R-XDFP-F24
JESD-609 Code e0
Memory Density 4194304 bit
Memory IC Type OTP ROM
Memory Width 16
Number of Functions 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX16
Package Body Material CERAMIC
Package Code DFP
Package Equivalence Code FL24,.4
Package Shape RECTANGULAR
Package Style FLATPACK
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.07 mA
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology TTL
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form FLAT
Terminal Pitch 1.27 mm
Terminal Position DUAL

Alternate Parts for MB7137HCF

This table gives cross-reference parts and alternative options found for MB7137HCF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MB7137HCF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HC6616/2KQH-C IC 2K X 8 OTPROM, 110 ns, CDFP24, CERAMIC, FP-24, Programmable ROM Honeywell Sensing and Control MB7137HCF vs HC6616/2KQH-C
63S1681WXXXX OTP ROM, 2KX8, 50ns, CMOS, CDFP24, Monolithic Memories (RETIRED) MB7137HCF vs 63S1681WXXXX
AM27S191A/BKA OTP ROM, 2KX8, 50ns, Bipolar, CDFP24, CERAMIC, FP-24 AMD MB7137HCF vs AM27S191A/BKA
5962-88735002LX OTP ROM, Waferscale Integration Inc MB7137HCF vs 5962-88735002LX
HC6616/1KQH-C IC 2K X 8 OTPROM, 110 ns, CDFP24, CERAMIC, FP-24, Programmable ROM Honeywell Sensing and Control MB7137HCF vs HC6616/1KQH-C
HC6616/2KSHZC OTP ROM, 2KX8, 110ns, CMOS, CDFP24, CERAMIC, FP-24 Honeywell Microelectronics & Precision Sensors MB7137HCF vs HC6616/2KSHZC
CY7C291A-35KMB OTP ROM, 2KX8, 35ns, CMOS, CDFP24, CERPACK-24 Cypress Semiconductor MB7137HCF vs CY7C291A-35KMB
93Z511FC OTP ROM, 2KX8, 45ns, TTL, CQFP24, CERPACK-24 Fairchild Semiconductor Corporation MB7137HCF vs 93Z511FC
HC6616/1KCHZT IC 2K X 8 OTPROM, 110 ns, CDFP24, CERAMIC, FP-24, Programmable ROM Honeywell Sensing and Control MB7137HCF vs HC6616/1KCHZT
5962-8873504KA OTP ROM, 2KX8, 25ns, CMOS, CDFP24, CERAMIC, FP-24 Teledyne e2v MB7137HCF vs 5962-8873504KA

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