MB7137HCF
vs
HC6616/1KQH-C
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FUJITSU LTD
|
HONEYWELL MICROELECTRONICS AND PRECISION SENSORS
|
| Package Description |
DFP, FL24,.4
|
DFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
70 ns
|
45 ns
|
| JESD-30 Code |
R-XDFP-F24
|
R-CDFP-F24
|
| JESD-609 Code |
e0
|
|
| Memory Density |
4194304 bit
|
262144 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
16
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
256000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
256KX16
|
32KX8
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL24,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.07 mA
|
0.03 mA
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
RADIATION-HARDENED ROM
|
| Length |
|
15.1384 mm
|
| Seated Height-Max |
|
3.175 mm
|
| Width |
|
10.16 mm
|
|
|
|
Compare MB7137HCF with alternatives
Compare HC6616/1KQH-C with alternatives