M38510/20404BEX by:

OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16

Part Details for M38510/20404BEX by Lansdale Semiconductor Inc

Overview of M38510/20404BEX by Lansdale Semiconductor Inc

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Available Datasheets

Part # Manufacturer Description Datasheet
M38510/12907BPA Rochester Electronics LLC And Gate Based Peripheral Driver, 2 Driver, 0.5A, BIPolar, CDIP8, CERAMIC, DIP-8
54LS242/BCA Rochester Electronics LLC 54LS242/BCA (DM: M38510/32801BCA)
5438/BCA Rochester Electronics 5438/BCA (DM: M38510/00303BCA)

Part Details for M38510/20404BEX

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M38510/20404BEX Part Data Attributes

M38510/20404BEX Lansdale Semiconductor Inc
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M38510/20404BEX Lansdale Semiconductor Inc OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16
Part Life Cycle Code Active
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP,
Pin Count 16
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 90 ns
JESD-30 Code R-XDIP-T16
Memory Density 262144 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 512 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material UNSPECIFIED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for M38510/20404BEX

This table gives cross-reference parts and alternative options found for M38510/20404BEX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/20404BEX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
82S130A/BEA OTP ROM, 512X4, 35ns, Bipolar, CDIP16 YAGEO Corporation M38510/20404BEX vs 82S130A/BEA
DM74S571BN IC 512 X 4 OTPROM, 35 ns, PDIP16, PLASTIC, DIP-16, Programmable ROM National Semiconductor Corporation M38510/20404BEX vs DM74S571BN
82S130A/BEA IC 512 X 4 OTPROM, 35 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM NXP Semiconductors M38510/20404BEX vs 82S130A/BEA
63S241AJXXXX OTP ROM, 512X4, 35ns, CMOS, CDIP16, Monolithic Memories (RETIRED) M38510/20404BEX vs 63S241AJXXXX
DM74S571BJ 512X4 OTPROM, 35ns, CDIP16, CERAMIC, DIP-16 Texas Instruments M38510/20404BEX vs DM74S571BJ
63S241AJ OTP ROM, 512X4, 35ns, CMOS, CDIP16, Monolithic Memories (RETIRED) M38510/20404BEX vs 63S241AJ
M38510/20403BEX OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 QP Semiconductor M38510/20404BEX vs M38510/20403BEX
M38510/20404BEX OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v M38510/20404BEX vs M38510/20404BEX
MB7116HM OTP ROM, 512X4, 35ns, Bipolar, PDIP16, PLASTIC, DIP-16 FUJITSU Semiconductor Limited M38510/20404BEX vs MB7116HM
M38510/20403BEA OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v M38510/20404BEX vs M38510/20403BEA
Part Number Description Manufacturer Compare
63S240NXXXX OTP ROM, 512X4, 45ns, CMOS, PDIP16, Monolithic Memories (RETIRED) M38510/20404BEX vs 63S240NXXXX
N82S130NB 512X4 OTPROM, 50ns, PDIP16 Philips Semiconductors M38510/20404BEX vs N82S130NB
AM27S12ADCB OTP ROM, 512X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD M38510/20404BEX vs AM27S12ADCB
53S241AJ883B OTP ROM, 512X4, 45ns, CMOS, CDIP16, Monolithic Memories (RETIRED) M38510/20404BEX vs 53S241AJ883B
AM27S12ADC OTP ROM, 512X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD M38510/20404BEX vs AM27S12ADC
HM1-7621-8 OTP ROM, 512X4, 85ns, TTL, CDIP16 Harris Semiconductor M38510/20404BEX vs HM1-7621-8
M38510/20403BEX OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v M38510/20404BEX vs M38510/20403BEX
AM27S13DC OTP ROM, 512X4, 50ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD M38510/20404BEX vs AM27S13DC
53S241J883B OTP ROM, 512X4, 55ns, CMOS, CDIP16, Monolithic Memories (RETIRED) M38510/20404BEX vs 53S241J883B
M38510/20402BEA OTP ROM, 512X4, 85ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Lansdale Semiconductor Inc M38510/20404BEX vs M38510/20402BEA

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