M38510/20404BEX vs M38510/20403BEX feature comparison

M38510/20404BEX Lansdale Semiconductor Inc

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M38510/20403BEX QP Semiconductor

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Part Life Cycle Code Active Transferred
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC QP SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 90 ns 35 ns
JESD-30 Code R-XDIP-T16 R-XDIP-T16
Memory Density 262144 bit 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 512 words 512 words
Number of Words Code 32000 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 512X4
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1

Compare M38510/20404BEX with alternatives

Compare M38510/20403BEX with alternatives