M38510/20404BEX vs AM27S12ADC feature comparison

M38510/20404BEX Lansdale Semiconductor Inc

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AM27S12ADC AMD

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 90 ns 150 ns
JESD-30 Code R-XDIP-T16 R-CDIP-T16
Memory Density 262144 bit 4194304 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 512 words 512 words
Number of Words Code 32000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 32KX8 512KX8
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 4
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Length 19.431 mm
Output Characteristics OPEN-COLLECTOR
Package Equivalence Code DIP16,.3
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/20404BEX with alternatives

Compare AM27S12ADC with alternatives